Abstract: A remote maintenance apparatus is provided. The remote maintenance apparatus includes: a first obtaining part which obtains configuration information of terminals sent from the terminals; a storing part which stores the configuration information while bringing the configuration information into correspondence with generation information; a second obtaining part which obtains configuration information of a failed terminal; and an extraction part which extracts difference information between configuration information obtained by the second obtaining part and configuration information stored in the storing part which has older generation.

Abstract: In a VoIP system that employs the AMR coding system, by classifying packets by means of unequal error protection implemented during data coding based on the AMR coding system, and by transmitting packets through transport channels 26 corresponding to the required quality for the respective packets, an efficient and high-quality mobile communication system is obtained.

Abstract: A system in which clients send data transfer requests to a server, and the server transmits data to the clients according to the data transfer requests. In the system, the server includes an access management part that creates access information representing an access state of the clients based on the data transfer requests from the clients, and manages access by the clients to the server based on the access information.

Abstract: A remote maintenance apparatus is provided. The remote maintenance apparatus includes: a first obtaining part which obtains configuration information of terminals sent from the terminals; a storing part which stores the configuration information while bringing the configuration information into correspondence with generation information; a second obtaining part which obtains configuration information of a failed terminal; and an extraction part which extracts difference information between configuration information obtained by the second obtaining part and configuration information stored in the storing part which has older generation.

Abstract: In a control valve abnormality detection method of detecting abnormality in a control valve, a characteristic expression representing the relationship between three factors in the normal state of the control valve is pre-set. The three factors consist of the displacement of the valve stem, a driving force from the valve stem driving device which changes upon displacement of the valve stem, and the force of the fluid which acts on one end of the valve stem through the valve. The three factors are detected on the basis of measurement result. On the basis of two factors selected from the detected three factors, the estimated value of one factor, which is not selected, is calculated by using the pre-set characteristic expression. The detected value of one factor, which is not selected, is compared with the calculated estimated value, and abnormality in the control valve is determined on the basis of the comparison result. A control valve abnormality detection apparatus is also disclosed.

Abstract: In a stick-slip detection method, the displacement of a movable member having a slidable contact portion is detected. A first quantity of state is calculated on the basis of the detected displacement of the movable member. A second quantity of state, which can be estimated from the first quantity of state, is calculated on the basis of the detected displacement of the movable member. An estimated quantity of state is calculated by estimating a second quantity of state from the calculated first quantity of state by using the relationship between the first and second predetermined quantities of state which are obtained from the displacement of the movable member in a normal sliding state. The calculated second quantity of state is compared with the estimated quantity of state to determine an abnormal sliding operation of the movable member on the basis of the comparison result. A stick-slip detection apparatus is also disclosed.

Abstract: This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

Abstract: The invention provides a novel data processor containing specific instructions including that which invalidates the content or branch records stored in cache memory, instruction queue, instruction pipeline, and branch prediction mechanism, and that which fetches and executed instructions having propriety, so that the data processor to securely coordinate the instruction string of main memory and those instructions to be actually processed, thus eventually preventing the instruction pipelines from conflict between them.

Abstract: This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

Abstract: This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

Abstract: This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat developed from the semiconductor chip mounted thereon and said substrate having a thermal expansion coefficient similar to those of semiconductor chip and other enclosure materials.

Abstract: A method and apparatus for processing exceptions in a microprocessor having a plurality of pipelined stages. The method comprises the steps of generating an exception processing code at a given stage to indicate the occurrence of an exception at the given stage; temporarily stopping processing at the given stage; transferring the exception processing code to a special stage; decoding said exception processing code at the special stage; and causing the pipeline to execute exception processing when the exception processing code is decoded at the special stage. Using the invention, the microprocessor can avoid much of the delay and complexity resulting from using an external circuit to control exception processing and can cope with the occurrence of an exception at any stage without prematurely cancelling or reexecuting processing steps. The invention is simplified in both hardware and software, and can easily cope with expansion of the number of stages.

Abstract: A semiconductor device package is disclosed, which comprises: a substrate of AlN with said semiconductor device affixed to it; a barrier layer of high melting point glass affixed to said substrate around said semiconductor device; a first layer of low melting point glass affixed to said barrier layer; a lead frame affixed to said first layer of low melting point glass and connected electrically to said semiconductor device; a second layer of said low melting point glass affixed to said lead frame on the opposite side from said first layer of low melting point glass; and a cap affixed to said second layer of low melting point glass. When the cap is of AlN, a second barrier layer of the high melting point glass is provided between the second layer of low melting point glass and the cap.

Abstract: A cast-iron product has a composition of 4.3-4.9 wt. % Carbon Equivalent (CE), 0.25-0.5 wt. % Chromium (Cr), 0.05-0.12 wt. % Tin (Sn), 0.4-1.2 wt. % Manganese (Mn), 0-0.1 wt. % Phosphorus (P), and 0-0.15 wt. % Sulfur (S), with the balance being Iron (Fe). A brake assembly comprises a sliding element made of such a cast iron, and the sliding element is adapted to slideably contact with a friction element or elements made of non-asbestos material and constitute the assembly. Further, a method of producing a cast iron product comprises the steps of casting a cast iron having a composition of 4.3-4.9 wt. % Carbon Equivalent (CE), 0.25-0.5 wt. % Chromium (Cr), 0.05-0.12 wt. % Tin (Sn), 0.4-1.2 wt. % Manganese (Mn), 0-0.1 wt. % Phosphorus (P), and 0-0.15 wt. % Sulfur (S), with the balance being Iron (Fe), releasing a mold at a temperature not less than A.sub.1 allotropic transformation temperature, and cooling the cast iron at a relatively high cooling rate.

Abstract: This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat developed from the semiconductor chip mounted thereon and said substrate having a thermal expansion coefficient similar to those of semiconductor chip and other enclosure materials.

Abstract: An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces, the power transmitting wirings being formed on entire peripheries of respective, dedicated ceramic plates. Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.

Abstract: A method for assay of enzyme activity which comprises treating an amide compound of the formula ##STR1## with peptidase; treating thus-liberated amine of the formula ##STR2## with an oxidase which consume oxygen and forms pigment by oxidative condensation of said amine with a coupler of the formula ##STR3## and quantitatively measuring the detectable changes. Also disclosed is an assay method which comprises treating an amide compound of the formula ##STR4## or a salt thereof, with peptidase to liberate an aniline derivative of the formula ##STR5## oxidizing said aniline derivative; and quantitatively measuring detectable change.

Abstract: A compound of the formula ##STR1## wherein R is L-leucyl or .gamma.-L-glutamyl and X and Y are halogen and are the same or different, or a salt thereof. These compounds are useful as synthetic substrates for assaying peptidase activity.

Abstract: The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order to obtain an insulated substrate not only capable of efficiently radiating the heat developed in the semiconductor chip but also having thermal expansion coefficient approximate to that of the semiconductor chip, or further coated with film of Cu or Al so that the substrate is provided with high thermal conductivity and required thermal expansion characteristics thereby enabling to produce semiconductor apparatus highly effective for the acceleration of increase of density, reduction of size and improvement of radiation of IC.