Abstract: A socket for an electrical part which is mounted to a circuit board includes a contact sheet disposed on the circuit board, and a land sheet disposed between the contact sheet and the electrical part. The contact sheet includes an elastic body in form of plate having elasticity and insulating property and a conductive portion embedded in the elastic body and the conductive portion has end portions exposed to both surfaces of the elastic body so as to be electrically connected to the land sheet. The land sheet is composed of an insulating sheet having both surfaces on which electrode portions are formed respectively to be electrically conductive to each other. One of the electrode portions is formed on one side of the surfaces of the land sheet to be contacted and electrically connected to a terminal of the electrical part, and the other one thereof is formed on the other one side of the surfaces of the land sheet to be contacted and electrically connected to the conductive portion of the contact sheet.

Abstract: A socket for an electrical part which is mounted to a circuit board includes a contact sheet disposed on the circuit board, and a land sheet disposed between the contact sheet and the electrical part. The contact sheet includes an elastic body in form of plate having elasticity and insulating property and a conductive portion embedded in the elastic body and the conductive portion has end portions exposed to both surfaces of the elastic body so as to be electrically connected to the land sheet. The land sheet is composed of an insulating sheet having both surfaces on which electrode portions are formed respectively to be electrically conductive to each other. One of the electrode portions is formed on one side of the surfaces of the land sheet to be contacted and electrically connected to a terminal of the electrical part, and the other one thereof is formed on the other one side of the surfaces of the land sheet to be contacted and electrically connected to the conductive portion of the contact sheet.

Abstract: For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device.

Abstract: For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device.