Abstract: A terminal includes a connector portion electrically connectable to an external terminal, a tubular crimp portion formed integrally or separate from the connector portion and crimps with a wire, and a transition portion coupling the two. The tubular crimp portion of a copper or copper alloy metal base material or a metal member having the same is a tubular member closed on transition portion side and reduces in diameter towards the transition portion side such that a conductor-end portion of the electric wire is un-exposed. The tubular crimp portion has a belt-shaped weld portion along a longitudinal direction of the tubular crimp portion. A circumferential direction of the tubular crimp portion matches the RD-direction of the base material. A sum of area ratios R1, R2 and R3 in a rolling plane of the base material, of Cube-, RDW-, and Goss-oriented crystal grains, respectively, is greater than or equal to 15%.

Abstract: A terminal includes a connector portion, a tubular crimp portion that crimps/joins with a wire, and a transition portion joining the two portions. The tubular crimp portion is composed of a metal member including a base material of copper or copper alloy with 0.20-1.40 mm thickness and a coating layer of tin, tin alloy, nickel, nickel alloy, silver or silver alloy with 0.2-3.0 ?m thickness formed on the base material. The tubular crimp portion has a weld portion formed by butt-welding and having, in its cross-section perpendicular to a terminal longitudinal direction, a phase existing therein of tin, tin alloy, nickel, nickel alloy, silver or silver alloy greater than 0.01 ?m2. The tubular crimp portion is a closed tubular body with one end opposite to a wire-insertion-opening being closed.

Abstract: A barrel portion which allows the pressure-bonding connection of an aluminum core wire exposed on a distal end of an insulated wire covered with an insulating cover is formed into a cylindrical shape by bending barrel portion corresponding portions of a terminal base material in a terminal developed state about a terminal axis. In abutting end portions where the barrel portion corresponding portions abut each other, a welded part which welds the end portions is formed along a long length direction of the insulated wire. The welded part is formed on an upper surface concave portion and a projecting portion where an amount of plastic deformation of a conductor pressure-bonding section generated along with the pressure-bonding of the conductor pressure-bonding section becomes larger compared to other portions in a circumferential direction of the conductor pressure-bonding section.

Abstract: The purpose of the present invention is to develop and provide a nucleic acid molecule that can specifically and efficiently inhibit the activity of a target RNAi molecule and can be produced safely at a low cost. Provided is a nucleic acid molecule for inhibiting the activity of a target RNAi molecule. The nucleic acid molecule comprises a single-stranded nucleic acid moiety that contains one unmodified DNA region composed of a nucleotide sequence completely or sufficiently complementary to a nucleotide sequence of a functional strand having the activity in the target RNAi molecule and a double-stranded nucleic acid moiety to be linked to at least one of the 5?-end and the 3?-end of the single-stranded nucleic acid moiety.

Abstract: In an electrical wire connecting structure and a method of manufacturing the electrical wire connecting structure, a terminal having a tube-shaped portion of 2.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 0.72 to 1.37 mm2, the electrical wire 13 is inserted into an electrical wire insertion port of the tube-shaped portion of the electrical wire, and the tube-shaped portion and the core wire portion of the electrical wire are compressed to be crimp-connected to each other. Furthermore, a terminal having a tube-shaped portion of 3.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 1.22 to 2.65 mm2, the electrical wire is inserted into the electrical wire insertion port of the tube-shaped portion 25 of the electrical wire, and the tube-shaped portion and the core wire portion of the electrical wire are compressed to be crimp-connected to each other.

Abstract: A semiconductor element is disclosed including a construction with electrode-dividing grooves, in which a dark current is smaller than in existing examples. A method of forming such grooves is also disclosed. In an embodiment, grooves, which electrically divide an electrode layer formed on the surface of a substrate, are formed with a V-shaped cross-sectional shape, groove side walls in the electrode layer, constituting the grooves, being sloping surfaces. An embodiment of the method of forming the grooves includes using a dicing blade having a blade distal end portion which is sharpened into a V-shape to cut a semiconductor wafer in which multiple patterns of semiconductor elements including an electrode layer on the surface of a substrate are formed, forming the grooves having a V-shaped cross-sectional shape which divide the electrode layer in each semiconductor element.

Abstract: Provided are an improved double-stranded nucleic acid molecule involved in gene expression control mediated by a gene silencing mechanism, a method of producing the molecule, and a pharmaceutical composition comprising the double-stranded nucleic acid molecule. The double-stranded nucleic acid molecule for gene expression control comprises an antisense strand having a length of 18 to 28 nucleotides and a sense strand including a complementary moiety composed of a sequence sufficiently complementary to the antisense strand and a protruding single-stranded 5?-end moiety having a length of 2 to 100 nucleotides. The sense strand and the antisense strand form base pairs via the complementary moiety. The method produces such a double-stranded nucleic acid molecule, and the pharmaceutical composition contains such a double-stranded nucleic acid molecule as an active ingredient.

Abstract: A terminal includes a tubular crimp portion that crimp connects with an electric wire. The tubular crimp portion is composed of a metal member. The tubular crimp portion includes a non-weld portion and a weld portion, the weld portion being formed by welding. A metal base material constituting the metal member of the non-weld portion includes a normal portion and an annealed portion.

Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide.

Abstract: A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: in which R1, R2, R3, and R4 each represent one selected from a hydrogen atom, an alkyl group, a hydroxyl group, a halogen atom, and an alkoxy group.

Abstract: Provided is a multilayer printed board 10 having three single-sided conductor pattern films 16 each having a conductor pattern 13 formed on one surface of a resin film 12 having a through hole 11 and a filled through hole 15 that is the through hole 11 filled with a conductor 14 integrally with the conductor pattern 13. These single-sided conductor pattern films 16 are stacked in such a manner that their tops are oriented in the same way. The conductor patterns 13 of the single-sided conductor pattern films 16 are electrically connected via the filled through holes 15. As the conductor patterns 13 of the single-sided conductor pattern films 16 are interlayer connected via the filled through holes 15, the interlayer connection reliability can be enhanced.

Abstract: A system and method for automatically controlling the speed of an automotive vehicle holds the vehicle speed constantly at a set vehicle speed when there are no other vehicles in front of the vehicle and controls the vehicle speed so as to follow another vehicle moving in front of the vehicle according to the distance between the two vehicles. The system disables both of the above-described functions when the vehicle speed is outside of a predetermined speed range around a set vehicle speed after the leading vehicle is no longer in front of the vehicle or a predetermined interval of time after the other vehicle has disappeared from a front detection area.

Abstract: A moving obstacle detection system using a Doppler radar device for an automotive vehicle which detects and informs a vehicle driver that another vehicle (moving obstacle) approaches or moves away from the detecting vehicle, wherein there is provided a means for determining whether the rate of change of the period of a Doppler signal outputted from the Doppler radar equipment with respect to time exceeds a predetermined value so that an erroneous alarm in response to a pedestrian or another vehicle traversing the front detection area of the vehicle, e.g., when vehicle is at rest at in an intersection is inhibited. Consequently, more reliable detection of approach or departure of another vehicle can be achieved.