Patents by Inventor Akira Takaguchi
Akira Takaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9956633Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.Type: GrantFiled: June 19, 2012Date of Patent: May 1, 2018Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Akira Takaguchi, Issaku Sato, Noboru Hashimoto, Junichi Okamura
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Patent number: 9511438Abstract: Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.Type: GrantFiled: October 18, 2012Date of Patent: December 6, 2016Assignee: Senju Metal Industry Co., Ltd.Inventors: Issaku Sato, Akira Takaguchi, Isamu Sato, Takashi Nauchi
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Publication number: 20150007958Abstract: Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.Type: ApplicationFiled: October 18, 2012Publication date: January 8, 2015Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Issaku Sato, Akira Takaguchi, Isamu Sato, Takashi Nauchi
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Patent number: 8544713Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.Type: GrantFiled: December 23, 2009Date of Patent: October 1, 2013Assignee: Senju Metal Industry Co., Ltd.Inventors: Issaku Sato, Akira Takaguchi
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Patent number: 8403199Abstract: To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. As shown in FIG.Type: GrantFiled: March 24, 2010Date of Patent: March 26, 2013Assignee: Senju Metal Industry Co., Ltd.Inventors: Issaku Sato, Akira Takaguchi
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Patent number: 8302835Abstract: To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus.Type: GrantFiled: December 28, 2009Date of Patent: November 6, 2012Assignee: Senju Metal Industry Co., Ltd.Inventors: Issaku Sato, Akira Takaguchi
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Publication number: 20120255987Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.Type: ApplicationFiled: June 19, 2012Publication date: October 11, 2012Inventors: Akira Takaguchi, Issaku Sato, Noboru Hashimoto, Junichi Okamura
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Publication number: 20120224837Abstract: A solder bath comprises a solder bath main body containing lead-free solder. A heating member heats the solder and is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member. The thermal diffusion member is heated by heat of the heating element to heat the solder bath main body evenly through thermal diffusion from the thermal diffusion member up to a constant range of temperature and the solder contained in the solder bath is heated evenly to a constant range of temperature.Type: ApplicationFiled: April 2, 2012Publication date: September 6, 2012Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Issaku SATO, Akira TAKAGUCHI
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Patent number: 8215534Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.Type: GrantFiled: October 8, 2004Date of Patent: July 10, 2012Assignee: Senju Metal Industry Co., Ltd.Inventors: Akira Takaguchi, Issaku Sato, Noboru Hashimoto, Junichi Okamura
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Publication number: 20120006886Abstract: To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. As shown in FIG.Type: ApplicationFiled: March 24, 2010Publication date: January 12, 2012Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Issaku Sato, Akira Takaguchi
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Publication number: 20110284619Abstract: To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus.Type: ApplicationFiled: December 28, 2009Publication date: November 24, 2011Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Issaku Sato, Akira Takaguchi
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Publication number: 20100163606Abstract: An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.Type: ApplicationFiled: December 23, 2009Publication date: July 1, 2010Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Issaku SATO, Akira TAKAGUCHI
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Publication number: 20100163600Abstract: A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.Type: ApplicationFiled: December 23, 2009Publication date: July 1, 2010Applicant: Senju Metal Industry Co., Ltd.Inventors: Issaku SATO, Akira TAKAGUCHI
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Publication number: 20080093417Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.Type: ApplicationFiled: October 8, 2004Publication date: April 24, 2008Inventors: Akira Takaguchi, Issaku Sato, Noboru Hashimoto, Junichi Okamura
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Patent number: 6915941Abstract: A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.Type: GrantFiled: August 30, 2002Date of Patent: July 12, 2005Assignees: Senju Metal Industry Co., Ltd., KTT Co., Ltd.Inventors: Akira Takaguchi, Masaki Wata, Chikara Numata
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Patent number: 6799709Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.Type: GrantFiled: December 18, 2002Date of Patent: October 5, 2004Assignees: Senju Metal Industry Co., Ltd., KTT Co., Ltd.Inventors: Akira Takaguchi, Masaki Wata, Chikara Numata
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Publication number: 20030111517Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.Type: ApplicationFiled: December 18, 2002Publication date: June 19, 2003Inventors: Akira Takaguchi, Masaki Wata, Chikara Numata
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Publication number: 20030066866Abstract: A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder Is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.Type: ApplicationFiled: August 30, 2002Publication date: April 10, 2003Inventors: Akira Takaguchi, Masaki Wata, Chikara Numata