Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.

Abstract: A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.

Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: A light-emitting diode includes a cup component, a plurality of electrical conducting traces formed on a surface of the cup component using an MID means, a light-emitting diode chip mounted on the cup component and electrically connected to at least a first and second electrical conducting trace of the plurality of electrical conducting traces, and a first connection part connected to at least the first and second electrical conducting traces for providing electrical connections to external circuitry. The light emitting diode may also include a protective element that electrically protects the light-emitting diode chip, and the connection part may include first and second leads connected electrically to the first and second electrical conducting traces, respectively. The cup component, light emitting diode chip, protective element, leads and other components may be assembled together and molded and sealed with resin.

Abstract: A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.