Abstract: A semiconductor device package having a semiconductor element of elements sealed in resin wherein a plurality of resin types different in function are used for sealing in which the more expensive resins are selectively used in forming thin covering layers for the semiconductor element and other components of the device, and the less expensive resin is used in a larger amount as an outer cover of a molded package. In another aspect of the semiconductor device package, bonding pads are provided at least in the active region of the semiconductor element or elements for wireless bonding of the semiconductor element to a circuit board. A stacked type semiconductor device package is also proposed wherein a plurality of semiconductor devices are stacked one atop the other, at least one of which has outer leads of longer length than the outer leads of the other semiconductor devices.