Patents by Inventor Akira YOSHIFUJI

Akira YOSHIFUJI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film, packaging bag using the film, and method of imparting heat sealing properties to the film
    Patent number: 10427377
    Abstract: A film having heat sealing properties, a packaging bag using the film and a method of imparting heat sealing properties to the film are provided. The film is made up of a single layer of biaxially stretched polyester or made up of a laminate including the layer of biaxially stretched polyester at a surface. The layer of biaxially stretched polyester includes a non-sealing portion having no heat sealing properties, and a sealing portion having heat sealing properties due to irradiation of laser light and exhibiting lower crystallinity compared to that of the non-sealing portion.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 1, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Shunsuke Yajima, Akira Yoshifuji
  • FILM, PACKAGING BAG USING THE FILM, AND METHOD OF IMPARTING HEAT SEALING PROPERTIES TO THE FILM
    Publication number: 20180186948
    Abstract: A film having heat sealing properties, a packaging bag using the film and a method of imparting heat sealing properties to the film are provided. The film is made up of a single layer of biaxially stretched polyester or made up of a laminate including the layer of biaxially stretched polyester at a surface. The layer of biaxially stretched polyester includes a non-sealing portion having no heat sealing properties, and a sealing portion having heat sealing properties due to irradiation of laser light and exhibiting lower crystallinity compared to that of the non-sealing portion.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 5, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Shunsuke YAJIMA, Akira YOSHIFUJI