Patents by Inventor Akitoshi Yamanaka
Akitoshi Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8919186Abstract: A fuel injection system for use with an internal combustion engine supplies fuel to an injector (fuel injection valve) from a common rail (accumulator) through a high-pressure pipe to spray the fuel from a spray hole formed in the injector. A thin-walled portion is formed in a path member (e.g., an injector body, the high-pressure pipe, or a connector connecting the injector and the high-pressure pipe) and defined by a locally thin wall of the path member. A strain gauge (strain sensor) is affixed to the thin-walled portion to measure strain of the thin-walled portion arising from the pressure of fuel in a high-pressure fuel path.Type: GrantFiled: October 27, 2008Date of Patent: December 30, 2014Assignee: Denso CorporationInventors: Jun Kondo, Tooru Taguchi, Hiroki Tanada, Akitoshi Yamanaka
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Patent number: 8590513Abstract: It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, a stem 51z (i.e., an elastic body) which is installed in said body 4z and elastically deformed when subjected to pressure of the high-pressure fluid, and a strain gauge 52z (i.e., a sensing device) which converts the degree of strain occurring at the stem 51z into an electric signal and outputs it as a measured-pressure signal. Specifically, the stain gauge 52z is installed on the stem 51z that is constructed as being separate from the body 4z.Type: GrantFiled: October 27, 2008Date of Patent: November 26, 2013Assignees: Denso Corporation, Nippon Soken, Inc.Inventors: Jun Kondo, Tooru Taguchi, Fumiaki Arikawa, Akitoshi Yamanaka
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Patent number: 8297259Abstract: It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, and a fuel pressure sensor 50z installed in the body 4z to measure the pressure of the high-pressure fuel. The body 4z has formed therein a branch path 6ez diverging from the high-pressure paths 6bz and 6cz to deliver the high-pressure fuel to the fuel pressure sensor 50z.Type: GrantFiled: October 27, 2008Date of Patent: October 30, 2012Assignees: Denso Corporation, Nippon Soken, Inc.Inventors: Jun Kondo, Tooru Taguchi, Fumiaki Arikawa, Daiji Ueda, Akitoshi Yamanaka
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Patent number: 8210040Abstract: An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.Type: GrantFiled: March 12, 2010Date of Patent: July 3, 2012Assignee: DENSO CORPORATIONInventors: Hirofumi Higuchi, Akitoshi Yamanaka, Tetsuo Fujii
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Patent number: 8169082Abstract: A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.Type: GrantFiled: November 2, 2011Date of Patent: May 1, 2012Assignee: DENSO CORPORATIONInventors: Tetsuo Fujii, Akitoshi Yamanaka, Hisanori Yokura
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Publication number: 20120049381Abstract: A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.Type: ApplicationFiled: November 2, 2011Publication date: March 1, 2012Applicant: DENSO CORPORATIONInventors: Tetsuo FUJII, Akitoshi Yamanaka, Hisanori Yokura
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Patent number: 8100344Abstract: A fuel injector which may be employed in injecting fuel into an internal combustion engine. The fuel injector includes an injector body and a head body formed to be separate from the injector body. The head body has installed therein a fuel pressure sensor working to measure the pressure of fuel in the fuel injector and is joined detachably to the injector body. The fuel injector alternatively includes an injector body and a fuel pressure-sensing unit equipped with a fuel pressure sensor. The fuel pressure-sensing unit is installed detachably on the injector body. This structure provides enhanced productivity of the fuel injector and facilitate the ease of replacement of the fuel pressure sensor.Type: GrantFiled: April 15, 2009Date of Patent: January 24, 2012Assignee: Denso CorporationInventors: Jun Kondo, Akitoshi Yamanaka
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Patent number: 8089144Abstract: A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.Type: GrantFiled: December 10, 2009Date of Patent: January 3, 2012Assignee: DENSO CORPORATIONInventors: Tetsuo Fujii, Akitoshi Yamanaka, Hisanori Yokura
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Patent number: 8009518Abstract: An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.Type: GrantFiled: December 23, 2008Date of Patent: August 30, 2011Assignees: DENSO CORPORATION, Nippon Soken, Inc.Inventors: Yasuyuki Okuda, Kiyonari Kojima, Teruo Oda, Akitoshi Yamanaka
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Fuel pressure sensor/sensor mount assembly, fuel injection apparatus, and pressure sensing apparatus
Patent number: 7963155Abstract: A fuel pressure sensor/sensor mount assembly in which a fuel pressure sensor is so mounted as to exposed to a high-pressure fuel path through which fuel is supplied to a fuel injector, a fuel injection apparatus equipped with a built-in fuel pressure sensor, and a pressure sensing apparatus working to measure the pressure of fuel in a fuel injector are provided. The fuel pressure sensor/sensor mount assembly is disposed between the high-pressure fuel path and the fuel injector, thus permitting the size of the fuel injector to be minimized without sacrificing the accuracy in measuring the pressure of the fuel. The fuel injection apparatus and the a pressure sensing apparatus are designed to ensure desired accuracy in measuring the pressure of the fuel.Type: GrantFiled: March 27, 2009Date of Patent: June 21, 2011Assignee: Denso CorporationInventors: Jun Kondo, Tooru Taguchi, Hideo Naruse, Akitoshi Yamanaka -
Publication number: 20110006130Abstract: It is used with a fuel injection system for an internal combustion engine which supplies fuel to an injector (fuel injection valve) from a common rail (accumulator) through a high-pressure pipe to spray the fuel from a spray hole formed in the injector. A thin-walled portion 70bz is formed in a path member (e.g., an injector body 4z, the high-pressure pipe, or a connector 70z connecting the injector and the high-pressure pipe) and defined by a locally thin wall of the path member. A strain gauge 60z (strain sensor) is affixed to the thin-walled portion 70bz to measure strain of the thin-walled portion 70bz arising from the pressure of fuel in a high-pressure fuel path 70az.Type: ApplicationFiled: October 27, 2008Publication date: January 13, 2011Applicant: Denso CorporationInventors: Jun Kondo, Tooru Taguchi, Hiroki Tanada, Akitoshi Yamanaka
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Publication number: 20100313850Abstract: It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, and a fuel pressure sensor 50z installed in the body 4z to measure the pressure of the high-pressure fuel. The body 4z has formed therein a branch path 6ez diverging from the high-pressure paths 6bz and 6cz to deliver the high-pressure fuel to the fuel pressure sensor 50z.Type: ApplicationFiled: October 27, 2008Publication date: December 16, 2010Applicants: DENSO CORPORATION, NIPPON SOKEN, INC.Inventors: Jun Kondo, Tooru Taguchi, Fumiaki Arikawa, Daiji Ueda, Akitoshi Yamanaka
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Publication number: 20100294242Abstract: It is equipped with an injector body 4z which has formed therein high-pressure paths 6az, 6bz, and 6cz through which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator 2z (i.e., an opening/closing mechanism) and a back-pressure control mechanism 3z (i.e., an opening/closing mechanism) which open or close the spray hole, a stem 51z (i.e., an elastic body) which is installed in said body 4z and elastically deformed when subjected to pressure of the high-pressure fluid, and a strain gauge 52z (i.e., a sensing device) which converts the degree of strain occurring at the stem 51z into an electric signal and outputs it as a measured-pressure signal. Specifically, the stain gauge 52z is installed on the stem 51z that is constructed as being separate from the body 4z.Type: ApplicationFiled: October 27, 2008Publication date: November 25, 2010Inventors: Jun Kondo, Tooru Taguchi, Fumiaki Arikawa, Akitoshi Yamanaka
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Publication number: 20100263633Abstract: The injector body 4z which forms therein the high-pressure paths 6az, 6hz, and 6cz through which high-pressure fuel flows to a spray hole and has disposed therein the piezo-actuator 2z (drive means) to drive a needle (valve) to open or close the spray hole, the fuel pressure sensor 50z which is installed in the body 4z to measure the pressure of the high-pressure fuel, the sensor terminals 55z to output a measured pressure value from the fuel pressure sensor 50z externally, the drive terminals 56z to which the electric power for the piezo-actuator 2z is supplied, and the connector housing 70z retaining the sensor terminals 55z and the drive terminals 56z are provided. The sensor terminals 55z, the drive terminals 56z, and the connector housing 70z constitute a single connector.Type: ApplicationFiled: October 27, 2008Publication date: October 21, 2010Applicants: Denso Corporation, Nippon Soken, Inc.Inventors: Jun Kondo, Tooru Taguchi, Tomoki Fujino, Fumiaki Arikawa, Akitoshi Yamanaka
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Publication number: 20100229646Abstract: An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.Type: ApplicationFiled: March 12, 2010Publication date: September 16, 2010Applicant: DENSO CORPORATIONInventors: Hirofumi HIGUCHI, Akitoshi Yamanaka, Tetsuo Fujii
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Patent number: 7770452Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.Type: GrantFiled: April 17, 2008Date of Patent: August 10, 2010Assignee: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Akitoshi Yamanaka
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Publication number: 20100148341Abstract: A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.Type: ApplicationFiled: December 10, 2009Publication date: June 17, 2010Applicant: DENSO CORPORATIONInventors: Tetsuo Fuji, Akitoshi Yamanaka, Hisanori Yokura
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Publication number: 20100096480Abstract: A fuel injector which may be employed in injecting fuel into an internal combustion engine. The fuel injector includes an injector body and a head body formed to be separate from the injector body. The head body has installed therein a fuel pressure sensor working to measure the pressure of fuel in the fuel injector and is joined detachably to the injector body. The fuel injector alternatively includes an injector body and a fuel pressure-sensing unit equipped with a fuel pressure sensor. The fuel pressure-sensing unit is installed detachably on the injector body. This structure provides enhanced productivity of the fuel injector and facilitate the ease of replacement of the fuel pressure sensor.Type: ApplicationFiled: April 15, 2009Publication date: April 22, 2010Applicant: DENSO CORPORATIONInventors: Jun Kondo, Akitoshi Yamanaka
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Patent number: 7615832Abstract: A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.Type: GrantFiled: February 8, 2007Date of Patent: November 10, 2009Assignee: DENSO CORPORATIONInventors: Ichiharu Kondoh, Ryuichiro Abe, Akitoshi Yamanaka, Yoshio Nakajima
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FUEL PRESSURE SENSOR/SENSOR MOUNT ASSEMBLY, FUEL INJECTION APPARATUS, AND PRESSURE SENSING APPARATUS
Publication number: 20090241650Abstract: A fuel pressure sensor/sensor mount assembly in which a fuel pressure sensor is so mounted as to exposed to a high-pressure fuel path through which fuel is supplied to a fuel injector, a fuel injection apparatus equipped with a built-in fuel pressure sensor, and a pressure sensing apparatus working to measure the pressure of fuel in a fuel injector are provided. The fuel pressure sensor/sensor mount assembly is disposed between the high-pressure fuel path and the fuel injector, thus permitting the size of the fuel injector to be minimized without sacrificing the accuracy in measuring the pressure of the fuel. The fuel injection apparatus and the a pressure sensing apparatus are designed to ensure desired accuracy in measuring the pressure of the fuel.Type: ApplicationFiled: March 27, 2009Publication date: October 1, 2009Applicant: DENSO CORPORATIONInventors: Jun Kondo, Tooru Taguchi, Hideo Naruse, Akitoshi Yamanaka