Abstract: An imaging table includes: a bucky apparatus to which a radiation imaging apparatus capable of being installed; a top plate connected to the bucky apparatus and allowing a subject to get on the top plate; and a rotation mechanism arranged to connect the bucky apparatus and the top plate in a relatively rotatable manner. The imaging table of the present invention can easily correspond to a plurality of imaging techniques.

Abstract: A radiographic apparatus includes a radiation detector, a heat generating member, a lower housing including a recess disposed at a position facing the heat generating member, and a heat transfer portion for transferring heat from the heat generating member to the lower housing. The heat transfer portion is disposed between the heat generating member and the recess, and is continuously disposed along the inner surface of the lower housing in a region other than the recess.

Abstract: In a radiation imaging system, which obtains a radiation image of an object based on a plurality of image signals, includes a radiation imaging apparatus, which includes a plurality of pixels arranged in a two-dimensional matrix, configured to convert an irradiated radiation transmitted through an object into an image signal serving as a partial image of the object. In the radiation imaging system, a holding unit for holding the radiation imaging apparatus holds the radiation imaging apparatus to be movable in a direction intersecting a direction in which positions to obtain a plurality of partial images are arranged.

Abstract: An information processing system including an information processing apparatus that receives captured radiographic images captured by a plurality of image capturing apparatuses each having a wireless communication function and a wired apparatus that connects to the information processing apparatus in a wired manner, the information processing system includes a setting unit that sets, in a case where one of the plurality of image capturing apparatuses is connected to the wired apparatus, the connected image capturing apparatus as a master unit of wireless communication, and a communication unit that receives, via the image capturing apparatus set as the master unit, a captured image of a different image capturing apparatus that is received through wireless communication by the image capturing apparatus set as the master unit from the different image capturing apparatus set as a slave unit of wireless communication.

Abstract: An information processing system including an information processing apparatus that receives captured radiographic images captured by a plurality of image capturing apparatuses each having a wireless communication function and a wired apparatus that connects to the information processing apparatus in a wired manner, the information processing system includes a setting unit that sets, in a case where one of the plurality of image capturing apparatuses is connected to the wired apparatus, the connected image capturing apparatus as a master unit of wireless communication, and a communication unit that receives, via the image capturing apparatus set as the master unit, a captured image of a different image capturing apparatus that is received through wireless communication by the image capturing apparatus set as the master unit from the different image capturing apparatus set as a slave unit of wireless communication.

Abstract: In a radiation imaging system, which obtains a radiation image of an object based on a plurality of image signals, includes a radiation imaging apparatus, which includes a plurality of pixels arranged in a two-dimensional matrix, configured to convert an irradiated radiation transmitted through an object into an image signal serving as a partial image of the object. In the radiation imaging system, a holding unit for holding the radiation imaging apparatus holds the radiation imaging apparatus to be movable in a direction intersecting a direction in which positions to obtain a plurality of partial images are arranged.

Abstract: A radiation detection apparatus comprising a sensor panel in which a plurality of sensors for detecting light are arranged, and a scintillator layer containing scintillator particles for converting an incident radiation into light, and an adhesive resin which has an adherence property and bonds the scintillator particles, wherein the scintillator layer is adhered to the sensor panel by the adhesive resin, a modulus of elasticity in tensile of the adhesive resin is higher than 0.7 GPa and lower than 3.5 GPa, and a volume ratio of the adhesive resin to the scintillator particles is not lower than 1% and not higher than 5%.

Abstract: A scintillator has a two-dimensional array of a plurality of columnar crystals which converts radiation into light, and a covering portion covering the two-dimensional array. The covering portion includes connecting portions configured to partially connect the columnar crystals while partially forming cavities in gaps between the columnar crystals in the two-dimensional array.

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Abstract: A radiation detection apparatus comprising a sensor panel and a scintillator panel is provided. The scintillator panel including a substrate, a scintillator disposed on the substrate, and a scintillator protective film that has a first organic protective layer and an inorganic protective layer, and covers the scintillator. The scintillator protective film is located between the sensor panel and the scintillator. The first organic protective layer is located on a scintillator side from the inorganic protective layer. A surface on a sensor panel side of the scintillator is partially in contact with the inorganic protective layer.

Abstract: A detection apparatus includes a conversion layer configured to convert incident light or radiation into a charge, electrodes configured to collect a charge produced as a result of the conversion by the conversion layer, and impurity semiconductor layers arranged between the electrodes and the conversion layer. The conversion layer is arranged over the electrodes so as to cover the electrodes. A part of the conversion layer which covers a region between an adjacent pair of the electrodes includes a portion smaller in film thickness than a part of the conversion layer which covers edges of the electrodes.

Abstract: A scintillator has a two-dimensional array of a plurality of columnar crystals which converts radiation into light, and a covering portion covering the two-dimensional array. The covering portion includes connecting portions configured to partially connect the columnar crystals while partially forming cavities in gaps between the columnar crystals in the two-dimensional array.

Abstract: The present invention provides a radiation imaging apparatus including a sensor substrate on which photoelectric conversion elements are arranged, a scintillator base on which a scintillator layer for converting radiation into light with a wavelength detectable by the photoelectric conversion elements is arranged, and which is adhered to the sensor substrate so that the scintillator layer is arranged between the sensor substrate and the scintillator base, and a sealing member configured to fix an edge portion of the scintillator base and the sensor substrate, and spaced apart from the scintillator layer, wherein the scintillator base includes a bent portion for reducing a stress that acts on the sealing member in a region between an outer edge of a region in which the scintillator layer is arranged and the edge portion fixed by the sealing member.

Abstract: A radiation detection apparatus comprising a sensor panel in which a plurality of sensors for detecting light are arranged, and a scintillator layer containing scintillator particles for converting an incident radiation into light, and an adhesive resin which has an adherence property and bonds the scintillator particles, wherein the scintillator layer is adhered to the sensor panel by the adhesive resin, a modulus of elasticity in tensile of the adhesive resin is higher than 0.7 GPa and lower than 3.5 GPa, and a volume ratio of the adhesive resin to the scintillator particles is not lower than 1% and not higher than 5%.

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract: A radiation detection apparatus comprising a sensor panel and a scintillator panel is provided. The scintillator panel including a substrate, a scintillator disposed on the substrate, and a scintillator protective film that has a first organic protective layer and an inorganic protective layer, and covers the scintillator. The scintillator protective film is located between the sensor panel and the scintillator. The first organic protective layer is located on a scintillator side from the inorganic protective layer. A surface on a sensor panel side of the scintillator is partially in contact with the inorganic protective layer.

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.