Patents by Inventor Akiyoshi Tainaka

Akiyoshi Tainaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded electronic component having pre-plated lead terminals and manufacturing process thereof
    Patent number: 6294826
    Abstract: A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: September 25, 2001
    Assignee: NEC Corporation
    Inventors: Yoshio Ida, Akiyoshi Tainaka
  • Chip type solid electrolytic capacitor
    Patent number: 6229688
    Abstract: A water vapor discharge passage 10 formed of fine porous fluorocarbon resin having high water vapor permeability is provided in a chip type solid electrolytic capacitor having a capacitor element 1 and an anode terminal 2 and a cathode terminal 3 for external electric connection and encapsulated in a mold resin 4. The water vapor discharge passage communicates an interior of the capacitor element with atmosphere.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: May 8, 2001
    Assignee: NEC Corporation
    Inventors: Atsushi Kobayashi, Akiyoshi Tainaka, Hideaki Sato
  • Process for manufacturing a molded electronic component having pre-plated lead terminals
    Patent number: 6127205
    Abstract: A process for manufacturing a molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: October 3, 2000
    Assignee: NEC Corporation
    Inventors: Yoshio Ida, Akiyoshi Tainaka