Abstract: A sample holder to be disposed between an electrostatic chuck and a sample smaller than the upper surface of the electrostatic chuck is provided, the sample holder including: a base plate formed in the same size as the upper surface of the electrostatic chuck; a sample placement portion located on the upper surface of the base plate, and designed to place the sample thereon; and a circumferential portion being a portion of the upper surface of the base plate other than the sample placement portion, and having a conductive material exposed to the outside.

Abstract: There is provided an electron beam detector including an electron beam scatterer which is disposed at a predetermined distance below a shield including a plurality of openings formed therein, and a beam detection element disposed at a predetermined distance below the scatterer and configured to convert an electron beam into an electric signal. In the electron beam detector, the scatterer is disposed at an equal distance from any of the openings in the shield, and the beam detection element is disposed at an equal distance from any of the openings in the shield. Thus, the electron beam detector can suppress a variation in detection sensitivity depending on the position of the opening.

Abstract: There is provided an electron beam detector including an electron beam scatterer which is disposed at a predetermined distance below a shield including a plurality of openings formed therein, and a beam detection element disposed at a predetermined distance below the scatterer and configured to convert an electron beam into an electric signal. In the electron beam detector, the scatterer is disposed at an equal distance from any of the openings in the shield, and the beam detection element is disposed at an equal distance from any of the openings in the shield. Thus, the electron beam detector can suppress a variation in detection sensitivity depending on the position of the opening.

Abstract: A sample holder to be disposed between an electrostatic chuck and a sample smaller than the upper surface of the electrostatic chuck is provided, the sample holder including: a base plate formed in the same size as the upper surface of the electrostatic chuck; a sample placement portion located on the upper surface of the base plate, and designed to place the sample thereon; and a circumferential portion being a portion of the upper surface of the base plate other than the sample placement portion, and having a conductive material exposed to the outside.

Abstract: A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.

Abstract: A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface. A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.

Abstract: A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof.

Abstract: A multi-layer printed wiring board including a first substrate having an opening and having external terminals positioned to be connected to a package substrate, a second substrate laminated to the first substrate and having external terminals positioned to be connected to a mother board, the second substrate having a metallic layer portion in the opening of the first substrate and non-through holes filled with conductive material and connected to the metallic layer portion, and an IC component having terminals and loaded in the opening of the first substrate such that the terminals of the IC component face an opposite side of the metallic layer portion of the second substrate. The IC chip is accommodated in the opening such that the metallic layer portion and non-through holes of the second substrate irradiate heat generated by the IC chip.

Abstract: A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface. A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.

Abstract: A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface. A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.

Abstract: In a multi-layer printed wiring board 100 comprising single side circuit boards A, B and for accommodating an IC chip 70, BGAs 56 are disposed on its front and rear faces, so that with an IC module 120 mounted through the BGA 56 on the front face, this board can be connected to a printed wiring board through the BGA 56 on the rear face. Thus, freedom in the configuration of the IC module mounted increases so that various kinds of the IC modules can be loaded.

Abstract: With using one scanning stage 19 where a plurality of wafers 16A to 16E is mounted through wafer holders 20A to 20E and balancing stage 21 disposed below scanning stage 19, scanning stage 19 is scanned based on exposure data common to a plurality of charged particle beam exposure apparatus 10A to 10E, and balancing stage 21 is scanned so that barycenter G of scanning stage 19 and balancing stage 21 becomes a fixed point. The positions of reflecting mirrors 70L and 70R secured to stage 19 are measured and based on their values, the expansion/contraction ratio of stage 19 and the positions of samples 16A to 16E are calculated to obtain deviation of the positions from target positions. Stage 19 is modeled such that rigid areas 19A to 19E are loosely connected, and for each area, the positions of three points are measured to calculate deviation of the exposure target position due to rotation of each ridged area. These deviations are corrected by deflectors 18A to 18D.

Abstract: With using one scanning stage 19 where a plurality of wafers 16A to 16E is mounted through wafer holders 20A to 20E and balancing stage 21 disposed below scanning stage 19, scanning stage 19 is scanned based on exposure data common to a plurality of charged particle beam exposure apparatus 10A to 10E, and balancing stage 21 is scanned so that barycenter G of scanning stage 19 and balancing stage 21 becomes a fixed point. The positions of reflecting mirrors 70L and 70R secured to stage 19 are measured and based on their values, the expansion/contraction ratio of stage 19 and the positions of samples 16A to 16E are calculated to obtain deviation of the positions from target positions. Stage 19 is modeled such that rigid areas 19A to 19E are loosely connected, and for each area, the positions of three points are measured to calculate deviation of the exposure target position due to rotation of each ridged area. These deviations are corrected by deflectors 18A to 18D.

Abstract: The present invention is a charged particle beam exposure apparatus comprising: a column portion in which an optical system for a charged particle beam is disposed; a chamber to be coupled with the column portion; a movable sample stage located in the chamber for mounting a sample thereon; and a stage position measurement device, having an optical path for measurement, along which a laser beam having a predetermined frequency is projected and is reflected by reflection means provided on the sample stage, and an optical path for reference, which in length almost equals a distance between a starting point of the optical path for measurement and the origin of the optical system in the column portion and for which the length is increased at a rate substantially consistent with a thermal expansion coefficient as material of the chamber is expanded, for measuring a change in position of the sample stage by employing a laser optical signal for measurement, which passes along the optical path for measurement, and a r