Patents by Inventor Al La Valle

Al La Valle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7525405
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: April 28, 2009
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Patent number: 6880232
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: April 19, 2005
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Publication number: 20030058074
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Publication number: 20030037946
    Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending), wherein the component retention socket itself facilitates safe and easy lead bending.
    Type: Application
    Filed: August 24, 2001
    Publication date: February 27, 2003
    Inventors: Patrick D. Boyd, Al La Valle, Jarett L. Rinaldi