Patents by Inventor Al Ogden

Al Ogden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and articles incorporating local stress for performance improvement of strained semiconductor devices
    Patent number: 7723720
    Abstract: A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting, enclosing and electrically connecting the chip (400) to the outside world, and structure for applying external stress (470) to induce strain in the thinned substrate region (410). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: May 25, 2010
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Toshikazu Nishida, Scott E. Thompson, Al Ogden, Kehuey Wu
  • Methods And Articles Incorporating Local Stress For Performance Improvement Of Strained Semiconductor Devices
    Publication number: 20090072371
    Abstract: A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting, enclosing and electrically connecting the chip (400) to the outside world, and structure for applying external stress (470) to induce strain in the thinned substrate region (410). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.
    Type: Application
    Filed: November 9, 2005
    Publication date: March 19, 2009
    Applicant: University of Florida Research Foundation, Inc.
    Inventors: Toshikazu Nishida, Scott E. Thompson, Al Ogden, Wu Kehuey