Abstract: The sensitivity and/or selectivity of a chemoresistor type gas sensor is enhanced by measuring the response of the sensing material to a gas sample while the sensing material is subjected to illumination using specially-tailored pulses of ultraviolet radiation. For a given target gas to be detected there is an optimal duration of the UV pulses to achieve peak sensitivity of the sensing material.

Abstract: The sensitivity and/or selectivity of a chemoresistor type gas sensor is enhanced by measuring the response of the sensing material to a gas sample while the sensing material is subjected to illumination using specially-tailored pulses of ultraviolet radiation. For a given target gas to be detected there is an optimal duration of the UV pulses to achieve peak sensitivity of the sensing material.

Abstract: A multi-storey gas sensor is constructed by stacking chemoresistor type gas sensing elements and providing holes through each sensing element so gas can pass from one sensing element to the next, through the sensing layers. A rich data set can be obtained by selecting appropriate combinations of materials for the different sensing layers and varying the operating conditions of the different gas-sensing elements by: taking measurements when different combinations of sensing layers are activated, when given sensing layers are heated to different temperatures or according to different heating profiles, and/or when selected sensing layers are exposed to UV light. Sensor sensitivity and selectivity can be increased by applying UV pulses of controlled duration, and target gas species can be detected based on the transient response of the sensing layer at onset of UV irradiation. Each sensing element may have a micro-hotplate architecture.

Abstract: A multi-storey gas sensor is constructed by stacking chemoresistor type gas sensing elements and providing holes through each sensing element so gas can pass from one sensing element to the next, through the sensing layers. A rich data set can be obtained by selecting appropriate combinations of materials for the different sensing layers and varying the operating conditions of the different gas-sensing elements by: taking measurements when different combinations of sensing layers are activated, when given sensing layers are heated to different temperatures or according to different heating profiles, and/or when selected sensing layers are exposed to UV light. Sensor sensitivity and selectivity can be increased by applying UV pulses of controlled duration, and target gas species can be detected based on the transient response of the sensing layer at onset of UV irradiation. Each sensing element may have a micro-hotplate architecture.

Abstract: A product (Pr) can be used in the semiconductor, MEM, flat screen and/or solar cell industries, where the product is capable of being gripped by a handling system (Bm). The product can include: a plate (1) made of silicon, quartz, silicon carbide, silicon nitride, arsenic, and/or gallium arsenide, comprising one first (2) and one second (3) opposite faces, a plateau (4) defined by at least one face (5) opposite the plate, an attachment means (7) of the plate (1) on the plateau (4) so that the at least one face (5) of the plateau (4) is opposite the first (2) or second (3) face of the plate, and a first gripping means (11) mounted in association with the plateau (4), where these said first gripping means is able to cooperate and is removable with second gripping means (12) in addition to the first gripping means (11), the second additional gripping means belonging to the handling system (Bm). Another embodiment of the invention is directed to a system for handling the product.

Abstract: A device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like is disclosed. The device includes a base including a flexible material equipped with an adhesive contact surface intended to be attached to said plate surface by adhesion, and means for differentiating the separation resistance between said adhesive contact surface made of the flexible material and the surface of the plate, in a direction perpendicular to the adhesive contact surface and in a direction parallel to said adhesive contact surface.

Abstract: A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: A device (12) to pick up at least one disc-shaped semi-conductor wafer (11) from a container (14) of such wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant, the device being situated on the opposite side (17) of the said aperture and the pick-up being effected through it. The device incorporates: A moving shutter (1) designed to move between a first, closed aperture, position and a second, open aperture, position that allows access to the inside of the container. A means of moving (18) this shutter between these first and second positions, the said movement taking place, at least in part, in a plane approximately parallel to the plane of the aperture.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A system for conveying and storing wafer containers in connection with wafer processing tools arranged in a row of a wafer fabrication facility and having substantially vertical faces in a common plane with wafer loading/unloading openings associated therewith includes a wafer container storage area, a wafer container temporary support, and a wafer container transfer mechanism. A row conveyor conveys wafer containers to the row. The wafer container transfer mechanism is located rearwardly of the vertical faces of the tools and the wafer container storage area, which has a plurality of stacked shelves, is located reawardly of the faces and above the tools in a subframe. The wafer container temporary support protrudes from the front of the faces. A wafer container transfer mechanism drive moves the wafer container transfer mechanism in X, Y, and Z directions in order to access the container storage area, the wafer container temporary support, and the openings of the tools.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged two receive a substrate container (8), the handling chamber (7) containing a first interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing a second interface (51) to connect the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which system a second measurement chamber (39) is provided, having the same second interface (51) as the first measurement chamber (30) to replace the latter chamber (30).

Abstract: Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged to receive a substrate container (8), the handling chamber (7) containing an interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing an interface (51) to connect to the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which a second measurement chamber (39) is provided, having the same interface (51) as the first measurement chamber (30) to replace the latter chamber (30).