Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Abstract: A lapping control system for accurately obtaining a desired throat height of each of a plurality of batch fabricated thin film magnetic transducers, comprises a row of thin film transducers formed on a substrate, the row comprising a height defining edge and at least four spaced sensing devices, a first two of the sensing devices comprising switch devices each offset a predetermined amount from the height defining edge, and a second two of the sensing devices comprising resistive devices each offset a predetermined amount from the height defining edge, a support of mounting the row of thin film magnetic transducers in a position to lap the height defining edge of each of the thin film magnetic transducers and the sensing devices, a measuring device for measuring the resistance of the resistive devices during lapping of the height defining edge, apparatus responsive to the measured resistance and to a selected state of at least one of the two switch devices for calibrating resistance versus throat height chara

Abstract: A novel thin film magnetic head fabrication process is provided for fabricating a plurality of thin film magnetic head elements. The process begins with the selection of an appropriate wafer substrate of suitable size and quality. At least two primary sub-areas of the wafer substrate are designated as work areas for the deposition of magnetic recording transducer elements. The work areas have first and second end portions and are arranged in mutually adjacent relation along a shared boundary zone that extends in a first direction through the wafer substrate between the first and second end portions. The wafer substrate is populated with plural rows of magnetic recording transducer elements in the designated work areas such that the plural rows extend in a second direction that is substantially perpendicular to the first direction. The work areas are separated from the wafer substrate and magnetic transducer slider elements are fabricated from the plural rows of magnetic recording transducer elements.

Abstract: A lapping control system for accurately obtaining a desired throat height of each of a plurality of batch fabricated thin film magnetic transducers, comprises a row of thin film transducers formed on a substrate, the row comprising a height defining edge and at least four spaced sensing devices, a first two of the sensing devices comprising switch devices each offset a predetermined amount from the height defining edge, and a second two of the sensing devices comprising resistive devices each offset a predetermined amount from the height defining edge, a support of mounting the row of thin film magnetic transducers in a position to lap the height defining edge of each of the thin film magnetic transducers and the sensing devices, a measuring device for measuring the resistance of the resistive devices during lapping of the height defining edge, apparatus responsive to the measured resistance and To a selected sate of at least one of the two switch devices for calibrating resistance versus throat height charac

Abstract: A lapping control system for a row of thin film magnetic transducers formed on a substrate. Each of the magnetic transducers comprises a magnetoresistive (MR) element, and the row is supported on a holder which has an elongated H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer at the middle of the beam member. The resistance of each of the MR elements is measured during lapping, and a control signal is generated to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.