Abstract: A system and method are disclosed for testing operation of a memory card within an electronic host device. The system includes a flat flexible cable, or strip, for electrically coupling between the memory card slot in a host device and a test assembly. The test assembly may have a card slot for accepting an external memory card, and a debug header for receiving a cable connected to a debug apparatus such as a logic analyzer and/or an oscilloscope.

Abstract: A system and method are disclosed for testing operation of a memory card within an electronic host device. The system includes a flat flexible cable, or strip, for electrically coupling between the memory card slot in a host device and a test assembly. The test assembly may have a card slot for accepting an external memory card, and a debug header for receiving a cable connected to a debug apparatus such as a logic analyzer and/or an oscilloscope.

Abstract: A semiconductor device is disclosed including die bond pads which are heightened to allow wire bonding of offset stacked die even in tight offset configurations. After a first die is affixed to a substrate, one or more layers of an electrical conductor may be provided on some or all of the die bond pads of the first substrate to raise the height of the bond pads. The conductive layers may for example be conductive balls deposited on the die bond pads of the first substrate using a known wire bond capillary. Thereafter, a second die may be added, and wire bonding of the first die may be accomplished using a known wire bond capillary mounting a wire bond ball on a raised surface of a first semiconductor die bond pad.

Abstract: A semiconductor device is disclosed including die bond pads which are heightened to allow wire bonding of offset stacked die even in tight offset configurations. After a first die is affixed to a substrate, one or more layers of an electrical conductor may be provided on some or all of the die bond pads of the first substrate to raise the height of the bond pads. The conductive layers may for example be conductive balls deposited on the die bond pads of the first substrate using a known wire bond capillary. Thereafter, a second die may be added, and wire bonding of the first die may be accomplished using a known wire bond capillary mounting a wire bond ball on a raised surface of a first semiconductor die bond pad.