Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: A method for software management of DMA transfer commands includes receiving a DMA transfer command instructing a data transfer by a first processor device. Based at least in part on a determination of runtime system resource availability, a device different from the first processor device is assigned to assist in transfer of at least a first portion of the data transfer. In some embodiments, the DMA transfer command instructs the first processor device to write a copy of data to a third processor device. Software analyzes network bus congestion at a shared communications bus and initiates DMA transfer via a multi-hop communications path to bypass the congested network bus.

Abstract: A method for hardware management of DMA transfer commands includes accessing, by a first DMA engine, a DMA transfer command and determining a first portion of a data transfer requested by the DMA transfer command. Transfer of a first portion of the data transfer by the first DMA engine is initiated based at least in part on the DMA transfer command. Similarly, a second portion of the data transfer by a second DMA engine is initiated based at least in part on the DMA transfer command. After transferring the first portion and the second portion of the data transfer, an indication is generated that signals completion of the data transfer requested by the DMA transfer command.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: A counterbalance system may include an outrigger support structure, a first elongated outrigger member, and a second elongated outrigger member. The outrigger support structure is adapted to be mounted in an operating position on a walking beam of a pumping unit. The first elongated outrigger member is connected to the outrigger support structure at a first lateral side of the counterbalance system. The second outrigger member is also connected to the outrigger support structure, but is connected at a second lateral side of the counterbalance system. A first suspension element may be connected to the first outrigger member and a second suspension element may be connected to the second outrigger member. Suitable counterbalance weights may be connected to the first suspension element while additional counterbalance weights may be connected to the second suspension element.

Abstract: A counterbalance system may include an outrigger support structure, a first elongated outrigger member, and a second elongated outrigger member. The outrigger support structure is adapted to be mounted in an operating position on a walking beam of a pumping unit. The first elongated outrigger member is connected to the outrigger support structure at a first lateral side of the counterbalance system. The second outrigger member is also connected to the outrigger support structure, but is connected at a second lateral side of the counterbalance system. A first suspension element may be connected to the first outrigger member and a second suspension element may be connected to the second outrigger member. Suitable counterbalance weights may be connected to the first suspension element while additional counterbalance weights may be connected to the second suspension element.

Abstract: The device is a counterbalance system and method to reduce the work of conventionally balanced, reciprocating cantilevered beam pumping units, and comprises a pair of transversely oriented support mounts attached to the cantilevered beam or walking beam of a pre-existing reciprocating pumping unit, attaching on either side of the pivoting-fulcrum, mounting point of the cantilevered walking beam. These transverse mounting points terminate individually on either side of said walking beam in channel-like saddles that support independent, parallel beams, which in turn cantilever themselves in tandem with said walking beam of the pumping unit; moreover, the position of the parallel beams by virtue of the transverse mounts creates a new center of gravity corresponding to the center of the pivoting mounting point of the walking beam, eliminating counter-productive torque forces on the walking beam as it tilts from horizontal.

Abstract: The device is a counterbalance system and method to reduce the work of conventionally balanced, reciprocating cantilevered beam pumping units, and comprises a pair of transversely oriented support mounts attached to the cantilevered beam or walking beam of a pre-existing reciprocating pumping unit, attaching on either side of the pivoting-fulcrum, mounting point of the cantilevered walking beam. These transverse mounting points terminate individually on either side of said walking beam in channel-like saddles that support independent, parallel beams, which in turn cantilever themselves in tandem with said walking beam of the pumping unit; moreover, the position of the parallel beams by virtue of the transverse mounts creates a new center of gravity corresponding to the center of the pivoting mounting point of the walking beam, eliminating counter-productive torque forces on the walking beam as it tilts from horizontal.

Abstract: An oven having one or more independently adjusted radiant heaters that can be dynamically adjusted before and during a curing or heating process to account for the shape and size of an object being cured or heated, further comprising a means for dynamically controlling the level of heat output from the radiant heaters. The oven preferably has radiant heaters positioned on opposing sides of the object and one or more back panels positioned behind the radiant heaters to absorb any radiant heat that misses the object. The oven of the present invention also has a turbulent fan and a means for deflecting the air flow of the convection heat throughout the internal oven chamber and toward the object. In addition, the oven has an exhaust fan that can discharge the exhaust either outside of the oven or redirect the exhaust back into the oven chamber to raise the ambient temperature, depending on the application for which the oven is being used.

Abstract: There is disclosed a chuck assembly for engaging the inner surface of a hollow substrate comprising: (a) a housing having an open end and defining a passageway in communication with the open end; (b) a partially hollow elastic boot defining an entry hole and an inner surface wherein the boot when stretched decreases in cross-sectional dimension, and wherein the boot engages the housing, whereby the hollow portion of the boot is in communication with the passageway; and (c) a movable, boot stretching member disposed in the passageway and adapted to engage the inner surface of the boot, wherein movement of the member in a direction to stretch the boot decreases the cross-sectional dimension of the boot, thereby permitting insertion of the boot into the substrate, and wherein movement of the member in the opposite direction increases the cross-sectional dimension of the boot, thereby permitting engagement of the boot against the inner surface of the substrate.

Abstract: A chuck assembly defining a longitudinal axis for internally holding a hollow substrate is disclosed including: (a) a stationary top pressing member; (b) a bottom pressing member movable along the longitudinal axis; (c) an elastic bag defining an opening, a top region, a side wall, and a bottom region, wherein the bag is stretchable along the longitudinal axis and a portion of the top region adjacent the side wall is immobilized against the stationary top pressing member during the stretching of the bag and a portion of the bottom region is coupled to the bottom pressing member; and (d) a width changing apparatus movable along the longitudinal axis, wherein the width changing apparatus is operatively coupled to the bottom pressing member.

Abstract: There is disclosed a carrier system for carrying a substrate batch including:(a) a heat treated, integral pallet having a pallet thickness, a top surface, and a bottom surface, wherein the pallet defines a plurality of passageways extending completely through the pallet thickness to form a first plurality of openings on the top surface and the bottom surface, wherein the pallet also defines a plurality of chambers extending through at least a portion of the pallet thickness to form a second plurality of openings on the bottom surface; and(b) a plurality of chuck assemblies partially disposed in the plurality of the chambers and adapted to engage the substrate batch, wherein the pallet has sufficient structural rigidity such that while the carrier system is carrying the substrate batch, even when the carrier system is subjected to an elevated temperature, there is absent any appreciable bending and twisting of the pallet.

Abstract: There is disclosed a chuck assembly defining a longitudinal axis for internally holding a hollow substrate having an open first end and a second end including: (a) an alignment shoulder positioned along the longitudinal axis; (b) an end portion, positioned along the longitudinal axis, that is adapted to be inserted into the substrate through the open first end and comprised of a polymeric member, wherein the polymeric member has a changeable width including a smaller width to permit insertion of the polymeric member into the substrate and a larger width to contact the polymeric member with the substrate inner surface, and the polymeric member is moveable along the longitudinal axis; and (c) a width changing apparatus operatively coupled to the polymeric member, wherein the polymeric member, which is in contact with the substrate inner surface, pulls the substrate a distance along the longitudinal axis towards the alignment shoulder when the polymeric member moves towards the alignment shoulder.