Abstract: A memory device including a reference voltage (VREF) generator and method for operating the same to improve memory sensing margin, and extend operational temperature range and life of the device are disclosed. Generally, the device further includes an array of non-volatile memory cells divided into a plurality of blocks, a sensing circuit coupled to the array to receive and compare memory signals therefrom to the VREF to read data from the cells. The Local reference voltage generator is configured to provide one of a number of reference voltages to the sensing circuit based on which of the blocks is being read. The array can be divided based on row and column addresses of cells in the blocks. Where the cells include 1T1C ferroelectric random access memory (F-RAM) cells, and the reference voltages are selected based on a lowest P-term or highest U-term of the cells in the block being read.

Abstract: A memory device including a reference voltage (VREF) generator and method for operating the same to improve memory sensing margin, and extend operational temperature range and life of the device are disclosed. Generally, the device further includes an array of non-volatile memory cells divided into a plurality of blocks, a sensing circuit coupled to the array to receive and compare memory signals therefrom to the VREF to read data from the cells. The Local reference voltage generator is configured to provide one of a number of reference voltages to the sensing circuit based on which of the blocks is being read. The array can be divided based on row and column addresses of cells in the blocks. Where the cells include 1T1C ferroelectric random access memory (F-RAM) cells, and the reference voltages are selected based on a lowest P-term or highest U-term of the cells in the block being read.

Abstract: A memory device and array which includes a static random access memory (SRAM) circuit coupled to a non-volatile circuit, such as a ferroelectric-RAM (F-RAM) circuit, in which the F-RAM circuit stores a bit of data from the SRAM circuit during power-out periods, the F-RAM circuit is further coupled to bit-line(s) to output the bit of data stored in the F-RAM circuit when operation power is restored.

Abstract: An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to the conductive layers, and affixing the substrates together with the conductive layers between the substrates. These are either separate substrates or a unitary substrate. The IC is mounted either to a substrate, a conductive layer, or a dielectric layer. The IC is coupled to the conductive layers either directly or through openings formed in the dielectric layer. An interior conductive layer may be used to couple the IC to the conductive layers.

Abstract: A memory cell includes a ferroelectric capacitor and a transistor connected between one side of the capacitor and a bit line. A drive circuit includes an operational amplifier having an output, an inverting input, and a non-inverting input. A plate line is connected between the other side of the capacitor and the output. The non-inverting input is connected to a data-in line through a first resistor and to the bit line through a second resistor. The inverting input is connected to a constant voltage source through a third resistor, and to the plate line through a fourth resistor. A first buffer amplifier is connected between the bit line and the second resistor, and a second buffer amplifier is connected between the plate line and the fourth resistor Voltage is connected to the other one of the operational amplifier inputs.

Abstract: A first terminal of a device-under-measurement (DUM) is connected to the input of a buffer amplifier having its output applied to the inverting input of an operational amplifier through a resistor having the value "aR". A resistor having a value "R" is connected between the inverting input and ground. A second terminal of the DUM is connected to the input of a buffer amplifier having its output connected to the non-inverting input of the operational amplifier through a resistor having the value "ar". The non-inverting input is also connected to the output of a signal generator through a resistor having the value "r". The second terminal is also connected to ground through a load. An oscilloscope is connected across the outputs of the buffer amplifiers, and a computer controls the signal generator in response to a signal from the oscilloscope.

Abstract: A memory cell includes a ferroelectric capacitor and a transistor connected between one side of the capacitor and a bit line. A drive circuit includes an operational amplifier having an output, an inverting input, and a non-inverting input. A plate line is connected between the other side of the capacitor and the output. The non-inverting input is connected to a data-in line through a first resistor and to the bit line through a second resistor. The inverting input is connected to a constant voltage source through a third resistor, and to the plate line through a fourth resistor. A first buffer amplifier is connected between the bit line and the second resistor, and a second buffer amplifier is connected between the plate line and the fourth resistor. Voltage is connected to the other one of the operational amplifier inputs.