Abstract: The resistance of a resistive memory element, e.g. a synaptic element is programmed, e.g. adjusted to a target value, by pulses of a constant height and variable width. One polarity gives an increase in resistance; the other polarity gives a decrease. A short pulse applied after a longer pulse appears to have no effect. After each polarity change short pulses can again be used to make small adjustments. In a preferred embodiment longer and longer pulses are used until the resistance overshoots the target value. After overshooting the polarity is reversed and a second series of pulses is used to obtain a closer approach to the target. The resistive element comprises a resistive layer located between two electrodes, e.g. a matrix of amorphous silicon doped with boron containing V. One electrode is Cr and the other is V.

Abstract: An analogue memory device comprises a layer of doped amorphous silicon located between a first conducting layer metal contact layer of V, Co, Ni, Pd, Fe or Mn. It has been found that the selection of one of these metals as the contact exerts a significant effect on the properties of the device, e.g. the selection of Al, Au or Cu gives no switching whereas Cr, W, Ag give digital instead of analogue switching.

Abstract: Insulating layers responsible for the trapping of electric charge in non-volatile semiconductor memories, such as FAMOS or MNOS, are fabricated as thicker layers when doped with metals having partially filled d or f electron shells. Typically the insulating layer is silicon oxide doped with up to 10 atomic % of a first transition series metal.

Abstract: A semiconductor device comprising superimposed layers of p- and n-doped semiconducting material (e.g. silicon) and electrical contact means for applying an electrical potential across the superimposed layers is characterized in that the p- and n-doped layers are both of amorphous semiconducting mateial (e.g. silicon) and one of said layers is much more heavily doped than the other. Suitably the less heavily doped layer has a thickness which is not greater than 2 .mu.m and the dopant concentration in the more heavily doped layer is one hundred or more times the dopant concentration of the less heavily doped layer. Preferably a third or quasi-intrinsic layer or substantially undoped amorphous semiconducting material (e.g. silicon) or electrically insulating material is applied to one of the doped layers between that layer and its electrical contact means. The device can be used as an electrically-programmable non-volatile semiconductor memory device.