Abstract: This invention is directed to a process for the fabrication of features on a silicon wafer utilizing fibers or ribbons comprising organic polymer and inorganic material.

Abstract: A screen-printable thick film paste composition suitable for forming conductive patterns on a rigid substrate comprising:(a) finely divided particles of a lead-free glass composition having a softening point log (eta)=7.6 poise from 400.degree. C.-650.degree. C., a log (eta.) specific viscosity in a range from 2 at 500.degree. C. to 5 at 700.degree. C. and consisting essentially of, by weight 65-95% Bi.sub.2 O.sub.3, 2-15% SiO.sub.2, 0.1-9% B.sub.2 O.sub.3, 0-5% Al.sub.2 O.sub.3, 0-5% CaO, and 0-20% ZnO; and(b) electrically conductive particles; andall of (a) and (b) being dispersed in (c) an organic medium.

Abstract: A screen-printable thick film paste composition suitable for forming conductive patterns on a rigid substrate comprising:(a) finely divided particles of a lead-free glass composition having a softening point log (eta)=7.6 poise from 400.degree. C.-650.degree. C., a log (eta.) specific viscosity in a range from 2 at 500.degree. C. to 5 at 700.degree. C. and consisting essentially of, by weight 65-95% Bi.sub.2 O.sub.3, 2-15% SiO.sub.2, 0.1-9% B.sub.2 O.sub.3, 0-5% Al.sub.2 O.sub.3, 0-5% CaO, and 0-20% ZnO; and(b) electrically conductive particles; andall of (a) and (b) being dispersed in (c) an organic medium.

Abstract: Thick film paste composition for applying conductive patterns to automotive window glass comprising finely divided particles of metallic silver, glass frit having transition metal oxide, contained in the glass, all of the particulate solids being dispersed in an organic medium.

Abstract: Thick film paste composition for applying conductive patterns to automotive window glass comprising finely divided particles of metallic silver, glass frit, and selected transition metal oxides, all of the particulate solids being dispersed in an organic medium.

Abstract: A method for making multilayer electronic circuits comprising the sequential steps of(1) applying to a substrate comprising a plurality of alternating dielectric and conductive layers a thick film dielectric paste containing a low-melting silicate glass;(2) applying to the dielectric paste layer a pattern of thick film conductor paste comprising finely divided particles of silver, an inorganic binder and a ruthenium- or rhodium-based sintering inhibitor, all dispersed in an organic medium; and(3) air cofiring the applied layers of thick film dielectric and conductive pastes.