Patents by Inventor Alan F. Dennis

Alan F. Dennis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854586
    Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: December 1, 2020
    Assignee: BAE Systems Information and Electronics Systems Integration Inc.
    Inventors: Lori D. Dennis, Jamie A. Bernard, Alan F. Dennis, Jane O. Gilliam, Jason F. Ross, Keith K. Sturcken, Dale A Rickard
  • Publication number: 20200373286
    Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 26, 2020
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Lori D. Dennis, Jamie A. Bernard, Alan F. Dennis, Jane O. Gilliam, Jason F. Ross, Keith K. Sturcken, Dale A Rickard
  • Patent number: 10700046
    Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: June 30, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Dale A Rickard, Jason F Ross, John T Matta, Richard J Ferguson, Alan F Dennis, Joseph R Marshall, Jr., Daniel L Stanley
  • Publication number: 20200051961
    Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 13, 2020
    Inventors: Dale A. Rickard, Jason F. Ross, John T. Matta, Richard J. Ferguson, Alan F. Dennis, Joseph R. Marshall, JR., Daniel L. Stanley
  • Patent number: 7142953
    Abstract: A reconfigurable digital processing system for space includes the utilization of field programmable gate arrays utilizing a hardware centric approach to reconfigure software processors in a space vehicle through the reprogramming of multiple FPGAs such that one obtains a power/performance characteristic for signal processing tasks that cannot be achieved simply through the use of off-the-shelf processors. In one embodiment, for damaged or otherwise inoperable signal processors located on a spacecraft, the remaining processors which are undamaged can be reconfigured through changing the machine language and binary to the field programmable gate arrays to change the core processor while at the same time maintaining undamaged components so that the signal processing functions can be restored utilizing a RAM-based FPGA as a signal processor.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: November 28, 2006
    Assignee: Bae Systems Information and Electronic Systems Integration Inc.
    Inventors: Joseph R. Marshall, Alan F. Dennis, Charles A. Dennis, Steven G. Santee
  • Patent number: 6996443
    Abstract: A reconfigurable digital processing system for space includes the utilization of field programmable gate arrays utilizing a hardware centric approach to reconfigure software processors in a space vehicle through the reprogramming of multiple FPGAs such that one obtains a power/performance characteristic for signal processing tasks that cannot be achieved simply through the use of off-the-shelf processors. In one embodiment, for damaged or otherwise inoperable signal processors located on a spacecraft, the remaining processors which are undamaged can be reconfigured through changing the machine language and binary to the field programmable gate arrays to change the core processor while at the same time maintaining undamaged components so that the signal processing functions can be restored utilizing a RAM-based FPGA as a signal processor.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: February 7, 2006
    Assignee: Bae Systems Information and Electronic Systems Integration Inc.
    Inventors: Joseph R. Marshall, Alan F. Dennis, Charles A. Dennis, Steven G. Santee
  • Publication number: 20040148069
    Abstract: A reconfigurable digital processing system for space includes the utilization of field programmable gate arrays utilizing a hardware centric approach to reconfigure software processors in a space vehicle through the reprogramming of multiple FPGAs such that one obtains a power/performance characteristic for signal processing tasks that cannot be achieved simply through the use of off-the-shelf processors. In one embodiment, for damaged or otherwise inoperable signal processors located on a spacecraft, the remaining processors which are undamaged can be reconfigured through changing the machine language and binary to the field programmable gate arrays to change the core processor while at the same time maintaining undamaged components so that the signal processing functions can be restored utilizing a RAM-based FPGA as a signal processor.
    Type: Application
    Filed: September 25, 2003
    Publication date: July 29, 2004
    Inventors: Joseph R. Marshall, Alan F. Dennis, Charles A. Dennis, Steven G. Santee
  • Publication number: 20040078103
    Abstract: A reconfigurable digital processing system for space includes the utilization of field programmable gate arrays utilizing a hardware centric approach to reconfigure software processors in a space vehicle through the reprogramming of multiple FPGAs such that one obtains a power/performance characteristic for signal processing tasks that cannot be achieved simply through the use of off-the-shelf processors. In one embodiment, for damaged or otherwise inoperable signal processors located on a spacecraft, the remaining processors which are undamaged can be reconfigured through changing the machine language and binary to the field programmable gate arrays to change the core processor while at the same time maintaining undamaged components so that the signal processing functions can be restored utilizing a RAM-based FPGA as a signal processor.
    Type: Application
    Filed: December 31, 2002
    Publication date: April 22, 2004
    Inventors: Joseph R. Marshall, Alan F. Dennis, Charles A. Dennis, Steven G. Santee