Abstract: Methods of coating a base tube are disclosed. Various methods include passing a hollow base tube into a coating die while maintaining a chamber pressure outside the hollow base tube that is lower than a pressure within an inner lumen of the hollow base tube. Such methods can include extruding coating material onto the hollow base tube to form a coated hollow tube by delivering coating material into the coating die. Vacuum may be formed within the coating die proximate a point of impingement where the coating material is applied to the hollow base tube.

Abstract: Methods of coating a base tube are disclosed. Various methods include passing a hollow base tube into a coating die while maintaining a chamber pressure outside the hollow base tube that is lower than a pressure within an inner lumen of the hollow base tube. Such methods can include extruding coating material onto the hollow base tube to form a coated hollow tube by delivering coating material into the coating die. Vacuum may be formed within the coating die proximate a point of impingement where the coating material is applied to the hollow base tube.

Abstract: The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.

Abstract: The present invention provides a method of manufacturing a porous chemical mechanical polishing pad comprising focusing a laser beam from a laser into a sintering nozzle and injecting the fluidized thermoplastic particles into the sintering nozzle via an injection port. The method further provides sintering the thermoplastic particles with the laser beam and selectively depositing the sintered thermoplastic particles onto a table to form the polishing pad.

Abstract: The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having an initial bulk density, wherein the storage hopper further comprises a porous membrane provided over a plenum. The method further provides the steps of connecting a fluidizing gas source to the plenum through a gas inlet line and fluidizing the microspheres and reducing the initial bulk density by feeding gas into the plenum. In addition, the method further provides the steps of providing a delivery system for delivering the polymeric materials and the microspheres to a mixer, forming a mixture of the polymeric materials and the microspheres, pouring the mixture into a mold to form a molded product and cutting the molded product into the polishing pad.

Abstract: The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres and a curative storage tank with curing agents. The apparatus further provides a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres and a recirculation loop in the premix prep tank for recirculating the pre-mixture until a desired bulk density is reached. The apparatus further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the curing agents and a mold for molding the mixture.

Abstract: The present invention provides an apparatus 20 for forming a striation-reduced chemical mechanical polishing pad 4. The polishing pad 4 comprises a first delivery line 66 for delivering a polymeric material 52 into a mixer 68 and a second delivery line 44 for delivering microspheres 48 into the mixer 68 with the polymeric material 52. The second delivery line 44 is connected to a bulk density control unit 21. The bulk density control unit 21 comprises a storage hopper 22 for storing the microspheres 48. The storage hopper 22 further comprises a porous membrane 24 provided over a plenum 26. A fluidizing gas source 23 is connected to the plenum 26 through a gas inlet line 27. Gas 28 fed into the plenum 26 from the fluidizing gas source 23 permeates through the porous membrane 24 and reduces the initial bulk density of the microspheres 48 in the storage hopper 22.

Abstract: The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.

Abstract: The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.

Abstract: A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.

Abstract: A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.