Abstract: A method for managing a processor, the processor comprising a common supply rail and processor cores being connected to the common supply rail, wherein each processor core comprises a core unit, wherein the method comprises detecting idle state exits indicated by the core units; and delaying a command execution of at least one of the core units indicating an idle state exit when the number of idle state exits exceeds a predetermined threshold idle state exit number may reduce voltage droops due to several processor cores leaving the idle state at the same time.

Abstract: A critical path monitor (CPM) having a set of split paths is configured in an integrated circuit (IC) that includes a corresponding set of critical paths. A first and a second split path is configured with a first and a second simulated delay sections and fine delay sections, respectively. A delay of each of the first and second fine delay sections is adjustable in several steps. The delay of the first fine delay section is adjustable differently from the delay of the second fine delay section in response to a common operating condition change. Differently adjusting the delays of the first and the second fine delay sections causes an edge of a pulse to be synchronized between a first edge detector located after the first simulated delay section and a second edge detector located after the second simulated delay section.

Abstract: A method for managing a processor, the processor comprising a common supply rail and processor cores being connected to the common supply rail, wherein each processor core comprises a core unit, wherein the method comprises detecting idle state exits indicated by the core units; and delaying a command execution of at least one of the core units indicating an idle state exit when the number of idle state exits exceeds a predetermined threshold idle state exit number may reduce voltage droops due to several processor cores leaving the idle state at the same time.

Abstract: A method and system for an infrastructure for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A critical path monitor circuit (infrastructure) is configured to launch a signal from a launch point in a first layer, the first layer being a first circuit. The infrastructure is further configured to create an electrical path to a capture point. The signal is launched from the launch point in the first layer. A performance characteristic of the electrical path is measured, resulting in a measurement, wherein the measurement is indicative of a performance of the first layer when stacked with a second layer in a 3D stack without actually stacking the first and the second layers in the 3D stack, the second layer being a second circuit.

Abstract: A critical path monitor (CPM) having a set of split paths is configured in an integrated circuit (IC) that includes a corresponding set of critical paths. A first and a second split path is configured with a first and a second simulated delay sections and fine delay sections, respectively. A delay of each of the first and second fine delay sections is adjustable in several steps. The delay of the first fine delay section is adjustable differently from the delay of the second fine delay section in response to a common operating condition change. Differently adjusting the delays of the first and the second fine delay sections causes an edge of a pulse to be synchronized between a first edge detector located after the first simulated delay section and a second edge detector located after the second simulated delay section.

Abstract: A critical path monitor (CPM) is configured in an integrated circuit (IC). The IC includes a set of critical paths. The CPM includes a set of split paths, a split path in the set of split paths corresponding to a critical path in the set of critical paths, and a split path in the set of split paths including an edge detector. The edge detector is configured with a set of edge detector latches. A set of set-reset (SR) latches is configured such that an edge detector latch is associated with a corresponding SR latch. A reset signal is configured to reach the set of edge detector latches in an offset synchronization with a latch clock signal used in the set of edge detector latches. The CPM is configured to operate using a frequency of the latch clock signal such that the frequency is higher than a threshold frequency.

Abstract: A method, system, and computer program product for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A first candidate chip is selected from a set of candidate chips for stacking, each candidate chip in the set of candidate chips including an integrated circuit. A part of a 3D performance determinant is activated in the first candidate chip. A value of a performance parameter is measured for a set of operating conditions. A stacked performance value is computed for the first candidate chip using the value. A subset of the set of candidate chips is stacked in a stack, the subset including the first candidate chip, such that a combined value of the performance parameter for the subset when stacked in a first order is within a defined range of values for the performance parameter.

Abstract: A method and system for an infrastructure for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A critical path monitor circuit (infrastructure) is configured to launch a signal from a launch point in a first layer, the first layer being a first circuit. The infrastructure is further configured to create an electrical path to a capture point. The signal is launched from the launch point in the first layer. A performance characteristic of the electrical path is measured, resulting in a measurement, wherein the measurement is indicative of a performance of the first layer when stacked with a second layer in a 3D stack without actually stacking the first and the second layers in the 3D stack, the second layer being a second circuit.

Abstract: A method, system, and computer program product for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A first candidate chip is selected from a set of candidate chips for stacking, each candidate chip in the set of candidate chips including an integrated circuit. A part of a 3D performance determinant is activated in the first candidate chip. A value of a performance parameter is measured for a set of operating conditions. A stacked performance value is computed for the first candidate chip using the value. A subset of the set of candidate chips is stacked in a stack, the subset including the first candidate chip, such that a combined value of the performance parameter for the subset when stacked in a first order is within a defined range of values for the performance parameter.

Abstract: A system and integrated circuit (die) including a clock generator that includes an on-chip inductor and uses the inherent capacitance of the load to generate a sinusoidal clock signal. The inductor is connected between a current source and an inverting switch. The output of the switch is a substantially sinusoidal signal that connected directly to at least a portion of the clock driven circuits without intermediate buffering. In the preferred embodiment, the clock generator is a dual phase design that includes a pair of cross-coupled MOSFET's, a pair of solid state on-chip inductors, and a current source. Each of the on-chip inductors is connected between the current source and the drain of one of the MOSFET's. The outputs of the clock generator are provided directly to the clock inputs of at least a portion of the clock driven circuits on the die.