Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.

Abstract: An electrical socket is disclosed for interfacing between a printed circuit board having contact pads and an electronic module having external leads, such as an integrated circuit. The electrical socket includes a base frame, containing an opening generally conforming to the body shape and size of the electronic module, and a plurality of spaced, parallel conductive members, such as electrical wires, arrayed on a resilient strip coextensive with at least part of the surface of the opening. Each conductive member includes both a lead portion in adjacent parallel relationship with one of the electronic module external leads and a contact portion in electrical engagement with a contact pad, and may also include a retaining portion for securing the conductive member to the resilient strip. The electrical socket may include a cover, with thermal vent holes, to secure the electronic module within the base frame opening.