Patents by Inventor Alan Ouye
Alan Ouye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8668776Abstract: Apparatus and method for forming thin layers on a substrate are provided. A processing chamber has a gas delivery assembly that comprises a lid with a cap portion and a covering member that together define an expanding channel at a central portion of the lid, the covering member having a tapered bottom surface extending from the expanding channel to a peripheral portion of the covering member. Gas conduits are coupled to the expanding channel and positioned at an angle from a center of the expanding channel to form a circular gas flow through the expanding channel. The bottom surface of the chamber lid is shaped and sized to substantially cover the substrate receiving surface. One or more valves are coupled to the passageway, and one or more gas sources are coupled to each valve. A choke is disposed on the chamber lid adjacent a perimeter of the tapered bottom surface.Type: GrantFiled: June 10, 2010Date of Patent: March 11, 2014Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima
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Publication number: 20120103526Abstract: The disclosure relates to a chamber component or a method for fabricating a chamber component for use in a plasma processing chamber apparatus. The chamber component includes a polished high purity aluminum coating and a hard anodized coating that is resistive to the plasma processing environment.Type: ApplicationFiled: October 19, 2011Publication date: May 3, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Alan Ouye, Renee Marguerite Koch
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Patent number: 8062422Abstract: Embodiments described herein are directed to an apparatus for generating a precursor for a semiconductor processing system. In one embodiment, an apparatus for generating a precursor gas during a vapor deposition process is described. The apparatus includes a canister containing an interior volume between a lid and a bottom, a gaseous inlet and a gaseous outlet disposed on the lid, a plurality of silos coupled to the bottom and extending from a lower region to an upper region of the interior volume, and a tantalum precursor having a chlorine concentration of about 5 ppm or less contained within the lower region of the canister.Type: GrantFiled: February 13, 2009Date of Patent: November 22, 2011Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20100247767Abstract: Apparatus and method for forming thin layers on a substrate are provided. A processing chamber has a gas delivery assembly that comprises a lid with a cap portion and a covering member that together define an expanding channel at a central portion of the lid, the covering member having a tapered bottom surface extending from the expanding channel to a peripheral portion of the covering member. Gas conduits are coupled to the expanding channel and positioned at an angle from a center of the expanding channel to form a circular gas flow through the expanding channel. The bottom surface of the chamber lid is shaped and sized to substantially cover the substrate receiving surface. One or more valves are coupled to the passageway, and one or more gas sources are coupled to each valve. A choke is disposed on the chamber lid adjacent a perimeter of the tapered bottom surface.Type: ApplicationFiled: June 10, 2010Publication date: September 30, 2010Inventors: LING CHEN, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima
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Patent number: 7780785Abstract: An apparatus and method for performing a cyclical layer deposition process, such as atomic layer deposition is provided. In one aspect, the apparatus includes a substrate support having a substrate receiving surface, and a chamber lid comprising a tapered passageway extending from a central portion of the chamber lid and a bottom surface extending from the passageway to a peripheral portion of the chamber lid, the bottom surface shaped and sized to substantially cover the substrate receiving surface. The apparatus also includes one or more valves coupled to the gradually expanding channel, and one or more gas sources coupled to each valve.Type: GrantFiled: October 25, 2002Date of Patent: August 24, 2010Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima, Mei Chang
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Patent number: 7780788Abstract: Apparatus and method for forming thin layers on a substrate are provided. A processing chamber has a gas delivery assembly that comprises a lid with a cap portion and a covering member that together define an expanding channel at a central portion of the lid, the covering member having a tapered bottom surface extending from the expanding channel to a peripheral portion of the covering member. Gas conduits are coupled to the expanding channel and positioned at an angle from a center of the expanding channel to form a circular gas flow through the expanding channel, The bottom surface of the chamber lid is shaped and sized to substantially cover the substrate receiving surface. One or more valves are coupled to the passageway, and one or more gas sources are coupled to each valve. A choke is disposed on the chamber lid adjacent a perimeter of the tapered bottom surface.Type: GrantFiled: March 11, 2005Date of Patent: August 24, 2010Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima
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Patent number: 7699023Abstract: Embodiments as described herein provide an apparatus and a method for performing an atomic layer deposition process. In one embodiment, a deposition chamber assembly contains a substrate support having a substrate receiving surface, and a chamber lid containing a tapered passageway extending from a central portion of the chamber lid, and a bottom surface extending from the passageway to a peripheral portion of the chamber lid, the bottom surface shaped and sized to substantially cover the substrate receiving surface. The system also includes one or more valves coupled to the gradually expanding channel, and one or more gas sources coupled to each valve. In one example, the gas source is a gas box assembly which is attached to the deposition chamber by at least one disconnect fitting and contains an inlet tube directed away from the gas outlet.Type: GrantFiled: October 26, 2007Date of Patent: April 20, 2010Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima, Mei Chang
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Patent number: 7597758Abstract: Embodiments of the invention provide chemical precursor ampoules that may be used during vapor deposition processes. In one embodiment, an apparatus for generating a chemical precursor gas used in a vapor deposition processing system is provided which includes a canister having a sidewall, a top, and a bottom forming an interior volume and a solid precursor material at least partially contained within a lower region of the interior volume. The apparatus further contains an inlet port and an outlet port in fluid communication with the interior volume and an inlet tube connected to the inlet port and positioned to direct a carrier gas towards the sidewall and away form the outlet port. In one example, the solid precursor contains pentakis(dimethylamido) tantalum (PDMAT). In another example, the apparatus contains a plurality of baffles that form an extended mean flow path between the inlet port and the outlet port.Type: GrantFiled: August 31, 2007Date of Patent: October 6, 2009Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Patent number: 7588736Abstract: Embodiments of an apparatus for generating a chemical precursor used in a vapor deposition processing system are provide which include a canister having a sidewall, a top, and a bottom forming an interior volume which is in fluid communication with an inlet port and an outlet port. The canister contains a plurality of baffles that extend from the bottom to an upper portion of the interior volume and form an extended mean flow path between the inlet port and the outlet port. In one embodiment, the baffles are contained on a prefabricated insert positioned on the bottom of the canister. In one example, an inlet tube may extend from the inlet port into the interior region and be positioned substantially parallel to the baffles. An outlet end of the inlet tube may be adapted to direct a gas flow away from the outlet port, such as towards the sidewall or top of the canister.Type: GrantFiled: May 16, 2006Date of Patent: September 15, 2009Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20090151633Abstract: Embodiments described herein are directed to an apparatus for generating a precursor for a semiconductor processing system. In one embodiment, an apparatus for generating a precursor gas during a vapor deposition process is described. The apparatus includes a canister containing an interior volume between a lid and a bottom, a gaseous inlet and a gaseous outlet disposed on the lid, a plurality of silos coupled to the bottom and extending from a lower region to an upper region of the interior volume, and a tantalum precursor having a chlorine concentration of about 5 ppm or less contained within the lower region of the canister.Type: ApplicationFiled: February 13, 2009Publication date: June 18, 2009Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Patent number: 7524374Abstract: Embodiments of the present invention are directed to an apparatus for generating a precursor for a semiconductor processing system (320). The apparatus includes a canister (300) having a sidewall (402), a top portion and a bottom portion. The canister (300) defines an interior volume (438) having an upper region (418) and a lower region (434). In one embodiment, the apparatus further includes a heater (430) partially surrounding the canister (300). The heater (430) creates a temperature gradient between the upper region (418) and the lower region (434). Also claimed is a method of forming a barrier layer from purified pentakis (dimethylamido) tantalum, for example a tantalum nitride barrier layer by atomic layer deposition.Type: GrantFiled: May 27, 2004Date of Patent: April 28, 2009Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20080216743Abstract: Embodiments of the invention provide chemical precursor ampoules that may be used during vapor deposition processes. In one embodiment, an apparatus for generating a chemical precursor gas used in a vapor deposition processing system is provided which includes a canister having a sidewall, a top, and a bottom forming an interior volume and a solid precursor material at least partially contained within a lower region of the interior volume. The apparatus further contains an inlet port and an outlet port in fluid communication with the interior volume and an inlet tube connected to the inlet port and positioned to direct a carrier gas towards the sidewall and away form the outlet port. In one example, the solid precursor contains pentakis(dimethylamido) tantalum (PDMAT). In another example, the apparatus contains a plurality of baffles that form an extended mean flow path between the inlet port and the outlet port.Type: ApplicationFiled: August 31, 2007Publication date: September 11, 2008Inventors: LING CHEN, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20080041313Abstract: Embodiments as described here provide an apparatus and a method for performing an atomic layer deposition process. In one embodiment, a deposition chamber assembly contains a substrate support having a substrate receiving surface, and a chamber lid containing a tapered passageway extending from a central portion of the chamber lid and a bottom surface extending from the passageway to a peripheral portion of the chamber lid, the bottom surface shaped and sized to substantially cover the substrate receiving surface. The system also includes one or more valves coupled to the gradually expanding channel, and one or more gas sources coupled to each valve. In one example, the gas source is an ampoule assembly which is attached to the deposition chamber by at least one disconnect fitting and contains an inlet tube directed away from the gas outlet.Type: ApplicationFiled: October 26, 2007Publication date: February 21, 2008Inventors: LING CHEN, VINCENT KU, DIEN-YEH WU, HUA CHUNG, ALAN OUYE, NORMAN NAKASHIMA, MEI CHANG
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Publication number: 20080038463Abstract: In one embodiment, a method for depositing a material on a substrate during an atomic layer deposition (ALD) process is provided which includes positioning the substrate on a substrate support within a process chamber, flowing a carrier gas into an expanding channel to form a circular flow of the carrier gas, exposing the substrate to the circular flow, pulsing a first reactant gas into the circular flow, and depositing a material onto the substrate. The method further provides that the process chamber has a chamber lid containing a centrally positioned expanding channel, a tapered bottom surface extending from the expanding channel to a peripheral portion of the chamber lid, at least two gas inlets in fluid communication with the expanding channel, and at least two conduits positioned to provide a gas flow having a circular pattern within the expanded channel.Type: ApplicationFiled: October 17, 2007Publication date: February 14, 2008Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima
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Patent number: 7270709Abstract: A precursor and method for filling a feature in a substrate. The method generally includes depositing a barrier layer, the barrier layer being formed from pentakis(dimethylamido)tantalum having less than about 5 ppm of impurities. The method additionally may include depositing a seed layer over the barrier layer and depositing a conductive layer over the seed layer. The precursor generally includes pentakis(dimethylamido)tantalum having less than about 5 ppm of impurities. The precursor is generated in a canister coupled to a heating element configured to reduce formation of impurities.Type: GrantFiled: May 2, 2005Date of Patent: September 18, 2007Assignee: Applied Materials, Inc.Inventors: Ling Chen, Vincent W. Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20070099415Abstract: In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes positioning a substrate having an underlying tungsten layer within a process chamber and depositing a tungsten-containing barrier layer on the underlying tungsten layer during a cyclical layer deposition process. The tungsten-containing barrier layer contains a refractory metal nitride material. The method further provides depositing a seed layer on the tungsten-containing barrier layer during a vapor deposition process and depositing a bulk tungsten layer on the seed layer during a chemical vapor deposition process.Type: ApplicationFiled: October 16, 2006Publication date: May 3, 2007Inventors: Ling Chen, Hua Chung, Sean Seutter, Michael Yang, Ming Xi, Vincent Ku, Dien-Yeh Wu, Alan Ouye, Norman Nakashima, Barry Chin, Hong Zhang
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Publication number: 20070067609Abstract: Embodiments of the present invention are directed to an apparatus for generating a precursor for a semiconductor processing system (320). The apparatus includes a canister (300) having a sidewall (402), a top portion and a bottom portion. The canister (300) defines an interior volume (438) having an upper region (418) and a lower region (434). In one embodiment, the apparatus further includes a heater (430) partially surrounding the canister (300). The heater (430) creates a temperature gradient between the upper region (418) and the lower region (434). Also claimed is a method of forming a barrier layer from purified pentakis(dimethylamido)tantalum, for example a tantalum nitride barrier layer by atomic layer deposition.Type: ApplicationFiled: May 27, 2004Publication date: March 22, 2007Inventors: Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20060257295Abstract: Embodiments of an apparatus for generating a chemical precursor used in a vapor deposition processing system are provide which include a canister having a sidewall, a top, and a bottom forming an interior volume which is in fluid communication with an inlet port and an outlet port. The canister contains a plurality of baffles that extend from the bottom to an upper portion of the interior volume and form an extended mean flow path between the inlet port and the outlet port. In one embodiment, the baffles are contained on a prefabricated insert positioned on the bottom of the canister. In one example, an inlet tube may extend from the inlet port into the interior region and be positioned substantially parallel to the baffles. An outlet end of the inlet tube may be adapted to direct a gas flow away from the outlet port, such as towards the sidewall or top of the canister.Type: ApplicationFiled: May 16, 2006Publication date: November 16, 2006Inventors: Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20050189072Abstract: A precursor and method for filling a feature in a substrate. The method generally includes depositing a barrier layer, the barrier layer being formed from pentakis(dimethylamido)tantalum having less than about 5 ppm of impurities. The method additionally may include depositing a seed layer over the barrier layer and depositing a conductive layer over the seed layer. The precursor generally includes pentakis(dimethylamido)tantalum having less than about 5 ppm of impurities. The precursor is generated in a canister coupled to a heating element configured to reduce formation of impurities.Type: ApplicationFiled: May 2, 2005Publication date: September 1, 2005Inventors: Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Seshadri Ganguli, Jenny Lin, Dien-Yeh Wu, Alan Ouye, Mei Chang
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Publication number: 20050173068Abstract: One embodiment of the gas delivery assembly comprises a covering member having an expanding channel at a central portion of the covering member and having a bottom surface extending from the expanding channel to a peripheral portion of the covering member. One or more gas conduits are coupled to the expanding channel in which the one or more gas conduits are positioned at an angle from a center of the expanding channel. One embodiment of a chamber comprises a substrate support having a substrate receiving surface. The chamber further includes a chamber lid having a passageway at a central portion of the chamber lid and a tapered bottom surface extending from the passageway to a peripheral portion of the chamber lid. The bottom surface of the chamber lid is shaped and sized to substantially cover the substrate receiving surface. One or more valves are coupled to the passageway, and one or more gas sources are coupled to each valve. In one aspect, the bottom surface of the chamber lid may be tapered.Type: ApplicationFiled: March 11, 2005Publication date: August 11, 2005Inventors: Ling Chen, Vincent Ku, Dien-Yeh Wu, Hua Chung, Alan Ouye, Norman Nakashima