Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.

Abstract: A tamper resistant semiconductor package includes a surface having flip chip electrical contacts. A flip chip semiconductor of the package also has flip chip electrical contacts. The flip chip semiconductor has a maximum temperature to which it can be exposed before being damaged. Flip chip solder joints physically couple and electrically connect the flip chip electrical contacts of the flip chip semiconductor to the flip chip electrical contacts of the surface. The flip chip solder joints are formed of an alloy having a higher melting point than the maximum temperature such that removal of the flip chip semiconductor from the surface by heating will destroy the functionality of the flip chip semiconductor.

Abstract: A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

Abstract: An electronic device includes a first silicon-based circuit carrying substrate and a die carried by the first silicon-based circuit carrying substrate. The silicon-based circuit carrying substrate is configured to electrically connect the die to other die. The device may include a second silicon-based circuit carrying substrate. The second silicon circuit carrying substrate may be closely coupled to the first silicon-based circuit carrying substrate. The device may also include a second die carried by the second silicon-based circuit carrying substrate.

Abstract: An electronic device includes a die, a first circuit substrate connected to the die, and a second circuit substrate closely coupled to the first circuit substrate. The die is located between the first and second circuit substrates and is protected from tampering by the close coupling of the first and second circuit substrates. The circuit substrates may be circuit carrying elements (e.g. circuit boards) or may be additional die, may be any number of other substrates, and/or may be a combination of substrates. The device may include a cavity such that the die is located in the cavity. The cavity could be formed by any number of means. The device may also include a second die connected to the second substrate such that the first die and second die are located in proximity to each other on opposite sides of the cavity.

Abstract: A method for protecting an electronic component including a semiconductor chip with a first elastic modulus includes steps as follows. At least one application of a first protective substance is applied on an outer surface of the semiconductor chip. The first protective substance has a second elastic modulus. A second substance is applied to an outer surface of the first protective substance. The second substance has a third elastic modulus. The second elastic modulus is substantially lower than the first elastic modulus and the third elastic modulus, and the first protective substance protects the semiconductor chip from damage during the application of the second substance and/or during the life of the semiconductor chip.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.

Abstract: A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Abstract: The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding thermally conductive particles to a low processing temperature, at least near-hermetic, glass-based coating. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to at least one of the integrated circuit and the substrate. The method further includes curing the coating.

Abstract: A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.