Abstract: Apparatus for manufacturing wiring harnesses employs a robot mounted above a harness board with storage areas for jigs, connectors, wire dispensers, and insertion tooling about the periphery thereof for easy pickup by robotic gripper, which positions jigs and connectors and laces wire from a wire dispensing assembly through the jigs before terminating and severing wire. Dispensing assembly comprises a dispenser which gripper picks up from a bracket in a holder to draw wire from endless source to lace the harness. The holder has wire feed wheels and a severing mechanism therein which may be used with a choice of dispensers in order to use different color or size wire. After termination and severing, pivoted platforms on wire jigs eject wire scraps from around lacing posts fixed on the jigs.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors. Bonding is conducted by clamping the leads to the conductors at the bond site, moving a heated anvil into contact with a heat conductive path to the bond site and withdrawing the heated anvil while maintaining the clamping.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

Abstract: An electrode assembly for simultaneously welding all the leads of a semiconductor chip to an outer lead frame is disclosed. The electrode assembly includes a gross electrode opposed to a plurality of spot electrodes, and a plurality of parallelogram support members for the spot electrodes, and a housing. Each of the plurality of parallelogram support members includes a first leg fixedly attached to the housing and a second leg supporting one of the spot electrodes. Each of the second legs is resiliently deformable into a stressed position when the electrode supported thereby is biased against the work piece whereby each spot electrode is independently responsive to structural changes in the work piece and contact is maintained between the work piece and the spot electrodes during the entire welding operation.

Abstract: A hitch feed assembly for automatically aligning individual lead frames at a bonding site in both the longitudinal and lateral directions is disclosed. The alignment is attained as a result of the cooperation between a plurality of chamfered pawls and the sprocket holes in the film-carrier. The pawls are chamfered along three sides in order to attain alignment in both the longitudinal and lateral directions. Significantly, the pawls come into operational contact with the sprocket holes while the lead frame film-carrier is under minimal tension so that the pressure exerted on the edges of the sprocket holes by the pawls will be minimal, thereby avoiding any deformation in the shape of the sprocket holes.

Abstract: Apparatus for accurately bonding leads to a semi-conductor die or the like includes a hitch feed and guide assembly for sequentially positioning each set of leads on a film carrier format over the die to be bonded to the leads. A micromanipulator adjusts the leads relative to the die prior to bonding. Displacement means provide unambiguous rectilinear separate movement of the bonding tool laterally into alignment with the lead and semi-conductor and then into contact with the leads to apply bonding heat and pressure.

Abstract: Bonding apparatus bonds inner leads on a film carrier to outer leads. Outer lead frame stock and the film carrier bearing the inner leads and dies are fed to the bonding site. A set of inner leads and the die thereto bonded is punched from the film carrier and moved to the bonding position in a manner such that the inner leads are aligned with the outer leads. A bonding tool effects the bond. Thereafter, the next set of outer leads and inner leads and die are advanced to the bonding site.