Abstract: The present disclosure relates to methods and intermediates useful for preparing a compound of formula I: or a co-crystal, solvate, salt or combination thereof.

Abstract: Crystalline Forms of a compound of Formula I are provided. Crystalline Form A is among the crystalline Forms identified. Form A has an X-ray powder diffraction (XRPD) pattern having characteristic peaks expressed in degrees 2? (±0.2° 2?) at 3.07, 5.96, 11.89 and 17.85, and a Differential Scanning Calorimetry (DSC) thermogram that exhibits an endotherm having a peak temperature of about 168.9° C.

Abstract: A sealed cabled assembly includes a cable and a cable moisture seal assembly. The cable includes a cable subcore, a metal shield layer surrounding the cable subcore, and a jacket surrounding the metal shield layer. The cable subcore includes an electrical conductor surrounded by an electrical insulation layer. The cable moisture seal assembly includes a sealant, a electrically conductive jumper member, and an outer sleeve. The cable includes a sealing region section extending from a first axial end to a second axial end, and in which a section of the jacket and a section of the metal shield layer are removed to expose a section of the cable subcore. The insulation layer and the conductor extend through the sealing region section. First and second sections of the jacket extend away from the sealing region section in first and second opposed directions, respectively.

Abstract: A pre-expanded cover assembly for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer, includes a splice body assembly and a removable holdout. The splice body assembly includes a tubular, cold-shrinkable, electrically insulative, elastomeric splice body having an interior surface defining an interior passage. The splice body assembly further includes a tubular layer of a conformable medium pre-mounted on the interior surface of the splice body. The conformable medium is a flowable material having a high electrical permittivity. The splice body assembly is mounted on the holdout such that the holdout maintains the splice body in an elastically radially expanded state, and the holdout is selectively removable from the splice body to permit the splice body to elastically radially contract.

Abstract: A system and method are provided for identifying active content in websites on a network. One embodiment includes a method of classifying web addresses. One embodiment may include a method of generating a score indicative of the reputation, or likelihood that a web site associated with an uncategorized URL contains active or other targeted content based on an analysis of the URL. In certain embodiments, the score is determined solely from the URL string. Other embodiments include systems configured to perform such methods.

Abstract: A pre-expanded cover assembly for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer, includes a splice body assembly and a removable holdout. The splice body assembly includes a tubular, cold-shrinkable, electrically insulative, elastomeric splice body having an interior surface defining an interior passage. The splice body assembly further includes a tubular layer of a conformable medium pre-mounted on the interior surface of the splice body. The conformable medium is a flowable material having a high electrical permittivity. The splice body assembly is mounted on the holdout such that the holdout maintains the splice body in an elastically radially expanded state, and the holdout is selectively removable from the splice body to permit the splice body to elastically radially contract.

Abstract: A sealed cabled assembly includes a cable and a cable moisture seal assembly. The cable includes a cable subcore, a metal shield layer surrounding the cable subcore, and a jacket surrounding the metal shield layer. The cable subcore includes an electrical conductor surrounded by an electrical insulation layer. The cable moisture seal assembly includes a sealant, a electrically conductive jumper member, and an outer sleeve. The cable includes a sealing region section extending from a first axial end to a second axial end, and in which a section of the jacket and a section of the metal shield layer are removed to expose a section of the cable subcore. The insulation layer and the conductor extend through the sealing region section. First and second sections of the jacket extend away from the sealing region section in first and second opposed directions, respectively.

Abstract: A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.

Abstract: A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.

Abstract: A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.

Abstract: Embodiments described herein relate to a composite cross arm for use with a utility structure and a program for selecting a cross arm. The cross arm includes a composite member, a hardware plate, and a mounting bracket. The program includes a data subroutine where the user selects the type of cross arm and inputs the required data. Thereafter, the program provides the appropriate cross-arm for the user.

Abstract: A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.

Abstract: A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.

Abstract: A system for cleaning semiconductor packages is provided which comprises a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.

Abstract: A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.

Abstract: A system and method are provided for identifying active content in websites on a network. One embodiment includes a method of classifying web addresses. One embodiment may include a method of generating a score indicative of the reputation, or likelihood that a web site associated with an uncategorized URL contains active or other targeted content based on an analysis of the URL. In certain embodiments, the score is determined solely from the URL string. Other embodiments include systems configured to perform such methods.

Abstract: A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.

Abstract: A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.