Abstract: A test device for testing integrated circuits includes a lid and a base joined at a hinge and secured together with a latch. Within the base is some form of socket body that electrically connects the integrated circuit under test to the item the socket is mounted to (i.e. load board). Attached to the lid are bearing assemblies. An incline cam that may or may not include arresting points along the incline, rotates on the bearings which are attached to the lid. A handle is attached to the cam. A pressure plate is attached to the cam. The cam, which is attached to the handle, provides a rotating means for lowering a pressure plate. The means for lowering a pressure plate may allow incremental lowering of a pressure plate by means of the stop points on the cam. The base may include a sight groove for examination of the integrated circuit and internal socket parts.

Abstract: A test device for testing integrated circuits includes a lid and a base joined at a hinge and secured together with a latch. Within the base is some form of socket body that electrically connects the integrated circuit under test to the item the socket is mounted to (i.e. load board). Attached to the lid are cam ratcheting levers. A pressure plate is attached to cam ratcheting levers. The cam ratcheting levers provide a rotating means for lowering a pressure plate by the use of the cam groove within the cam ratcheting levers. The means for lowering a pressure plate may allow incremental lowering of a pressure plate through the ratcheting action of the cam ratcheting levers. The base may include a sight groove for examination of the integrated circuit and internal socket parts.

Abstract: Provided is a low iron containing glass particularly useful for automotive and architectural purposes which achieves low levels of UV, IR, and total solar (TS) transmittances without the use of nickel oxide, and in certain embodiments, through selective amounts of B.sub.2 O.sub.3.

Abstract: A proteinaceous mass of fungal mycelial fibers is treated by rapid dielectric heating to reduce the moisture content by from 8 to 40 weight percent to give a product with a solids level of 30 to 70 weight percent, and preferably a solids level of 40 to 60 weight percent. The initial proteinaceous mass may be pretreated such as by aqueous thermal shock to reduce the nucleic acid content, before it is formed into fiber bundles of from 0.2 to 1.0 mm. in diameter, and having an average length to diameter ratio of greater than 20. These bundles are interconnected by groups of hyphae or by single hyphal with average diameter of from 0.004 to 0.01 mm. and length to diameter ratio of from 10 to 1000. The dielectric heating process puffs and crosslinks (heat sets) the product which then may be further dried such as in a hot air oven to reduce the moisture content of the mass to the desired level below 10 weight percent. The product is rehydratable to 1 to 5 and preferably 1.5 to 3.