Abstract: A wafer holding device supports a wafer during semiconductor processing. The device has a planar disk member with a raised supporting edge on which the wafer sits. Cooling gas passes through an aperture in the disk member to contact the bottom surface of the wafer. An O-ring, which sits on or near the raised supporting edge, is used to maintain an airtight seal between the wafer and the wafer holding device. Pegs or a ridge on the supporting edge fix the rotational position of the wafer. The wafer is secured to the device using a ring member, with holes for the ridge or pegs, placed on top of the wafer. At the bottom of the disk member is an annular projection that is held by a robotic transfer mechanism during transport into the process chamber. The projection fits processing equipment designed to hold standard-sized wafers.