Abstract: A method of manufacturing a semiconductor memory device, the method including forming a tunnel insulation layer on a substrate, forming a preliminary charge trapping layer on the tunnel insulation layer, forming an etch stop layer on the preliminary charge trapping layer, wherein a portion of the preliminary charge trapping layer is not covered by the etch stop layer, removing the exposed portion of the preliminary charge trapping layer to form a charge trapping layer having a uniform thickness, forming a dielectric layer on the charge trapping layer, and forming a gate electrode on the dielectric layer.

Abstract: A method of reading data in a non-volatile memory device includes applying a bit line read voltage to a bit line and a selected cell read voltage to a word line, both of which are electrically connected to a selected cell located in a selected string. A first read voltage is applied to word lines electrically connected to first non-selected cells separated from the selected cell in the selected string, and a second read voltage is applied to word lines electrically connected to second non-selected cells adjacent to the selected cell in the selected string. The second read voltage is lower than the first read voltage. A pass voltage is applied to turn on a string select transistor and a ground select transistor, respectively, in the selected string. An electrical signal output from the selected string is compared with a standard signal to read data stored in the selected cell.

Abstract: A method of reading data in a non-volatile memory device includes applying a bit line read voltage to a bit line and a selected cell read voltage to a word line, both of which are electrically connected to a selected cell located in a selected string. A first read voltage is applied to word lines electrically connected to first non-selected cells separated from the selected cell in the selected string, and a second read voltage is applied to word lines electrically connected to second non-selected cells adjacent to the selected cell in the selected string. The second read voltage is lower than the first read voltage. A pass voltage is applied to turn on a string select transistor and a ground select transistor, respectively, in the selected string. An electrical signal output from the selected string is compared with a standard signal to read data stored in the selected cell.

Abstract: In methods of manufacturing a memory device, a tunnel insulation layer is formed on a substrate. A floating gate having a substantially uniform thickness is formed on the tunnel insulation layer. A dielectric layer is formed on the floating gate. A control gate is formed on the dielectric layer. A flash memory device including the floating gate may have more uniform operating characteristics.