Patents by Inventor Albert Grosser

Albert Grosser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for analysis of a sample on a test element
    Patent number: 8692119
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: April 8, 2014
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thoes, Herbert Wieder
  • Device for analysis of a sample on a test element
    Patent number: 8330046
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: December 11, 2012
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thös, Herbert Wieder
  • DEVICE FOR ANALYSIS OF A SAMPLE ON A TEST ELEMENT
    Publication number: 20080277280
    Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
    Type: Application
    Filed: April 18, 2008
    Publication date: November 13, 2008
    Inventors: Stefan Riebel, Manfred Augstein, Gregor Bainczyk, Albert Grosser, Oliver Kube, Dieter Meinecke, Bruno Thos, Herbert Wieder