Abstract: A power bus is described that connects a matrix of power supplies to a circuit board in a computer system. The power bus is substantially planar and attached to the circuit board so that the power bus and circuit board are parallel to one another. This parallel relationship decreases the amount of space utilized by the circuit board in the computer system. The circuit board also has connectors for delivering power directly to a load which increases the efficiency of power delivery.

Abstract: An electronic assembly (e.g., a supercomputer) wherein different levels of substrates, each having a plurality of heat-generating electronic components (e.g., resistors, capacitors, power supplies, VLSI modules) thereon, is described. The assembly includes a cooling structure centrally disposed therein for providing cooling fluid to each of the heat generating components to cool same. In a preferred embodiment, the cooling structure comprises a plurality of concentrically disposed duct members (e.g., of thermoplastic), which each in turn include a longitudinal chamber portion and a flared end portion. The flared end portion is particularly designed to direct the cooling fluid in a plurality of directions, depending on the requirements of the assembly. Diffusing structure (e.g., an apertured plate) may also be used to assure passage of turbulent, even fluid flow through each duct member.