Abstract: Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple leadframe routing layers in a plated and etched copper terminal semiconductor package by removing unwanted areas of each leadframe to create conductive paths on an associated leadframe layer of the semiconductor package.

Abstract: Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple leadframe routing layers in a plated and etched copper terminal semiconductor package by removing unwanted areas of each leadframe to create conductive paths on an associated leadframe layer of the semiconductor package.

Abstract: Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple leadframe routing layers in a plated and etched copper terminal semiconductor package by removing unwanted areas of each leadframe to create conductive paths on an associated leadframe layer of the semiconductor package.

Abstract: Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

Abstract: Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

Abstract: A new ground land is provided on the BGA package that allows for increasing the test sensitivity of a wire bond tester. The ground land is interconnected with a ground ring that is provided in the immediate vicinity of the BGA device. The ground land of the invention is provided such that the location of the ground land does not unduly interfere with essential functions and locations of other components that are required for the mounting of the BGA device, most preferably in a corner of the BGA device package.

Abstract: A new pattern is provided for the bus lines that are used to facilitate plating of layers of electrical lines that form a Printed Circuit Board. Where Prior Art bus lines have a straight-line geometry, the bus lines of the invention have any geometry that is not a straight-line geometry. The geometry of the bus lines of the invention can be of any design as long as this design allows for interrupted cutting of the bus line, that is the cutting tool does not, during the process of cutting the bus line, make constant and continuous contact with the bus line.