Abstract: Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.

Abstract: Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.

Abstract: According to the present invention, a blank of an aluminum alloy is partially cut so as to form several disks maintained in the blank by portions of the remaining uncut aluminum. This results in the disks being supported in the blank during formation of the thin films, yet easily separated from the blank into individual disks after the thin films have been deposited. Therefore, multiple disks can be processed during a single manufacturing step.

Abstract: A composite insulator structure separating adjacent layers of patterned metal on an LSI chip is disclosed. The bottom layer of sputtered oxide is thicker than the top layer and is preferably planarized. The top layer is conformal plasma nitride so as to uncover unwanted projections on the underlying metal and prevent interlevel shorting between the patterned layers.