Patents by Inventor Albert Schott

Albert Schott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and electronic configuration
    Patent number: 7183652
    Abstract: An electronic component includes a substrate with outer contact areas comprising copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: February 27, 2007
    Assignee: Infineon Technologies AG
    Inventors: Bernd Waidhas, Gerald Bock, Albert Schott
  • Electronic component and electronic configuration
    Publication number: 20070018308
    Abstract: An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
    Type: Application
    Filed: March 14, 2006
    Publication date: January 25, 2007
    Inventors: Albert Schott, Bernd Rakow, Bernd Waidhas, Juergen Walter, Christian Birzer, Rainer Steiner, Bernhard Schaetzler, Thomas Ort, Gerald Bock
  • Electronic component and electronic configuration
    Publication number: 20060244142
    Abstract: An electronic component includes a substrate with outer contact areas comprising copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.
    Type: Application
    Filed: April 27, 2005
    Publication date: November 2, 2006
    Inventors: Bernd Waidhas, Gerald Bock, Albert Schott