Abstract: A fiber optic communications cable for providing a short range, high speed data communications link between information system units, including an optical fiber with an integral housing at each end having an electrical connector extending from the housing and adapted to mate with a corresponding electrical connector on an external information system unit for transferring an information signal between the cable and the unit. A signal converter in the integral housing's converts the information signal between an electrical signal and a corresponding optical signal.

Abstract: A fiber optic communications cable for providing a short range, high speed data communications link between information system units, including an optical fiber with an integral housing at each end having an electrical connector extending from the housing and adapted to mate with a corresponding electrical connector on an external information system unit for transferring an information signal between the cable and the unit. A signal converter in the integral housing's converts the information signal between an electrical signal and a corresponding optical signal.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconnects at the bottom. The multi-fold structure allows the FPCB to support a higher number of traces than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips at the front of the fiber-optic module, thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces, resulting in improved signal integrity over conventional multi-layer FPCB's.

Abstract: The packaging system comprises a mechanical support, an insulating substrate and an electronic circuit. The mechanical support has a first support element that extends at a non-zero angle from a second support element. The insulating substrate has a first portion and a second portion in contact with the first support element and the second support element, respectively. The first portion is contoured to define at least one access hole. The optical communications device and the electronic circuit are mechanically coupled to the first support element. Either or both the optical communications device and the electronic circuit is mechanically coupled to the first support element through a respective one of the at least one access hole. The packaging device additionally comprises a conductive track extending between the electronic circuit and the optical communications device on the first portion of the insulating substrate.

Abstract: An orthogonal electrical connector using a ball edge array includes one or more stackable fiber optic transceivers, wherein each transceiver includes an electrical substrate, and arrays of solder, which is in form of solder balls or solder paste. The solder is held in predetermined position adjacent to the electrical traces on both sides of the electrical substrate inserted into voids on the molded housing and aligned to contact the electrical traces on the motherboard. The electrical traces on the electrical substrate and the motherboard are located close enough so that the solder physically touches both parts during the soldering process. The solder is reflowed by heat, and the melted solder “wicks up” the electrical traces on the electrical substrate by surface tension.

Abstract: A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconnects at the bottom. The multi-fold structure allows the FPCB to support a higher number of traces than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips at the front of the fiber-optic module, thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces, resulting in improved signal integrity over conventional multi-layer FPCB's.

Abstract: A connector housing for a connector to an optical device includes: a body with a bottom wall, a first side wall with a first lip, a second side wall with a second lip, where optical fibers may reside within the bottom, first side, and second side walls, where the first and second lips engage the optical fibers when residing within the bottom, first, and second side walls, where the first and second lips assist in preventing the optical fibers from being removed from the body; a spring coupled to the body and the optical fibers; and a sleeve coupled to the body, including a locking feature for locking the body to the optical device. The connector housing is compact in size, allowing larger numbers of fiber-optic modules to reside on a printed circuit board, increasing its density for optical devices. A connector with the connector housing is also more cost effective to manufacture.

Abstract: A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.

Abstract: A connector housing for a connector to an optical device includes: a body with a bottom wall, a first side wall with a first lip, a second side wall with a second lip, where optical fibers may reside within the bottom, first side, and second side walls, where the first and second lips engage the optical fibers when residing within the bottom, first, and second side walls, where the first and second lips assist in preventing the optical fibers from being removed from the body; a spring coupled to the body and the optical fibers; and a sleeve coupled to the body, including a locking feature for locking the body to the optical device. The connector housing is compact in size, allowing larger numbers of fiber-optic modules to reside on a printed circuit board, increasing its density for optical devices. A connector with the connector housing is also more cost effective to manufacture.

Abstract: A modular fiber-optic transceiver has an optoelectronic subassembly stack assembled in the beam direction and parallel to the plane of the mounting site. The subassembly is formed in various combinations of individually designed building modules for aligning, focusing, optoelectronic processing and eventual cooling. The subassembly is electrically conductive connected to a transceiver board and kept in perpendicular orientation to it by a snap fitting housing. The housing holds the cable plug of the fiber cable in position and transmits thereby the peripheral imposed mechanical load directly onto the mounting site. The modular building concept supports various techniques for fiber optic data transmission.

Abstract: An optical assembly includes an optical subassembly containing a prefabricated long wavelength laser optically coupled to a prefabricated short wavelength laser located in a housing. The optical subassembly may be removably installed in the housing in which the short wavelength laser is contained. The short wavelength laser optically pumps the long wavelength laser resulting in a long wavelength laser output. The optical subassembly allows the independent fabrication, optimization and testing of the short wavelength laser and the long wavelength laser.

Abstract: A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An optical subassembly and a method of fabricating the same utilize a subassembly body that is formed by molding the subassembly body onto a substrate. Preferably, the subassembly body is constructed of a plastic material that can be molded into a precise shape. The subassembly body and the substrate become an integral unit when the molded plastic material is polymerized. The optical subassembly includes the subassembly body, the substrate, an optical element, an optoelectronic device, and a transmitter or receiver integrated circuit (IC) chip. The optoelectronic device and the transmitter/receiver IC chip are affixed to the substrate. Preferably, the substrate is a flexible circuit having a number of electrical traces. The flexible circuit may be composed of a polymer material. The optoelectronic device is positioned on the substrate such that the optoelectronic device is located within an opening in the subassembly body.

Abstract: A Vertical Cavity Surface-Emitting Laser (VCSEL) assembly in which the polarization is locked to a specified direction that is the same for all VCSELs. A VCSEL according to the present invention includes a VCSEL having a top mirror region, a bottom mirror region, a light generation region between the top and bottom mirror regions, a conducting substrate and a bottom electrode. The bottom mirror region is sandwiched between the conducting substrate and the light generation region, and the conducting substrate is sandwiched between the bottom electrode and the bottom mirror region. The assembly also includes a mounting substrate having top and bottom surfaces, the VCSEL being mechanically coupled to the mounting substrate. The mounting substrate includes a means for defining a first axis. The assembly includes a means for causing the mounting substrate to flex about the first axis thereby inducing a strain in the light generation region which locks the polarization into a mode determined by the first axis.

Abstract: An optical fiber faceplate transmits light signals between an optical fiber communications device and optical fibers secured by a fiber optic connector. The optical fiber faceplate includes a plurality of closely spaced optical fiber segments which prevent light signals from diverging as they pass through the faceplate. The diameters of the cores of the optical fiber segments within the faceplate are smaller than the diameters of the optical fibers secured by the fiber optic connector. Therefore, light from optical signals communicated by the optical fibers is received and transmitted through the faceplate via a plurality of optical fiber segments within the faceplate. Consequently, the faceplate does not need to be precisely aligned with either the optical fibers or the optical communications device.

Abstract: A VCSEL that is adapted to the fabrication of an array of VCSELs. A VCSEL array according to the present invention includes first and second VCSELs for generating light of a predetermined wavelength. Each VCSEL includes a bottom reflector comprising an epitaxial layer of a semiconductor of a first conductivity type, a light generation region and a top reflector comprising a semiconductor of a second conductivity type. A bottom electrode is electrically connected to the bottom reflector, and a top electrode is electrically connected to the top reflector. The bottom electrode is grown on top of a buffer layer having an electrical conductivity less than a predetermined value and a crystalline structure that permits epitaxial growth of the bottom reflector on the buffer layer. The buffer layer may be grown on top of a substrate or be the substrate itself in the case in which a substrate having sufficiently low conductivity is utilized.

Abstract: A substantially n-type substrate structure having a p-type surface for use in semiconductor devices as a substitute for a p-type semiconductor substrate. The substrate structure comprises a substrate region and a buffer region. The substrate region is a region of n-type compound semiconductor, and includes a degeneratively n-doped portion adjacent its first surface. The buffer region is a region of compound semiconductor doped with a p-type dopant. The buffer region is located on the first surface of the substrate region and includes a surface remote from the substrate region that provides the p-type surface of the substrate structure. The buffer region also includes a degeneratively p-doped portion adjacent the degeneratively n-doped portion of the substrate region. The substrate structure includes a tunnel junction between the degeneratively n-doped portion of the substrate region and the degeneratively p-doped portion of the buffer region.