Abstract: A dishwasher for receiving and cleansing soiled kitchenware includes a tub defining a washing chamber, a movable door for selectively exposing the washing chamber, and a modular, slidably mounted drip pan and component mounting assembly or base member positioned below the tub. One or more of a plurality of wash system components, including a wash pump, an inlet valve and a drain valve, is mounted to the modular base member. The modular base member includes connection points for household utilities, a peripheral lip or rim so as to contain any liquid that may fall from the dishwasher tub and a float and cut-off system that serves to terminate operation of the dishwasher upon detecting a water leak. In addition, the modular base member may also contain a system for heating washing fluid to a desired temperature, along with related control components.

Abstract: A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

Abstract: A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coefficient of thermal expansion which is approximately equal to the coefficient of thermal expansion of the substrate. The method also includes disposing the polymeric stencil on the substrate such that the stencil aperture is aligned with a conductive region; and reflowing the solder paste while the polymeric stencil remains disposed on the substrate. The polymeric stencil is then removed from the substrate essentially without any solder-paste being removed with the polymeric stencil.

Abstract: An interconnect assembly and a fluxless method for forming the interconnect assembly. The fluxless method includes providing a first semiconductor substrate having a first pad connected thereto. A post is connected to the first pad and includes a length greater than a thickness of the first pad, and a metallic solder disposed on an associated end of the post. A second semiconductor substrate is provided as having a second pad connected thereto. The fluxless method further includes depositing an unfilled polymeric liquid on the second pad, aligning and contacting the metallic solder with the unfilled polymeric liquid, and forcing by pressure the first and second semiconductor substrate toward each while simultaneously heating the metallic solder and the unfilled polymeric liquid to form a metallurgical joint between the second pad and the metallic solder.

Abstract: A method for forming a plurality of solder bumps comprising providing a pair of metallic supports. An initial solder layer is respectively disposed on each of the metallic supports which may be a metal-filled blind via. One or two additional solder layers are disposed on one of the initial solder layers. A multilayered packaging assembly includes the solder layer(s) on a plurality of substrates which are coupled together.

Abstract: An interconnect assembly and a fluxless method for forming the interconnect assembly. The fluxless method includes providing a first semiconductor substrate having a first pad connected thereto. A post is connected to the first pad and includes a length greater than a thickness of the first pad, and a metallic solder disposed on an associated end of the post. A second semiconductor substrate is provided as having a second pad connected thereto. The fluxless method further includes depositing an unfilled polymeric liquid on the second pad, aligning and contacting the metallic solder with the unfilled polymeric liquid, and forcing by pressure the first and second semiconductor substrate toward each while simultaneously heating the metallic solder and the unfilled polymeric liquid to form a metallurgical joint between the second pad and the metallic solder.

Abstract: A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

Abstract: A connector for repairing and connecting at least one section of a first electrical cable having an outer surface, an interior end, an exterior end, and a central conductor portion. The connector includes a sleeve having first and second open ends, and a hollow interior to permit the passage of fluid therethrough. The connector also includes a port providing fluid communication with the hollow interior of the sleeve and into the central conductor portion of the first electrical cable. The sleeve is capable of receiving and forming a fluid-tight seal with the interior end of the first electrical cable.

Abstract: A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coefficient of thermal expansion which is approximately equal to the coefficient of thermal expansion of the substrate. The method also includes disposing the polymeric stencil on the substrate such that the stencil aperture is aligned with a conductive region; and reflowing the solder paste while the polymeric stencil remains disposed on the substrate. The polymeric stencil is then removed from the substrate essentially without any solder-paste being removed with the polymeric stencil.

Abstract: A method for depositing a solder paste or other conductive or non-conductive material on a contact pad or other designated region of a substrate. A layer of resist is applied over the boundary of a region in which a bump of a deposited material is to be formed. The resist layer is applied by a screen printing process in which the portion of the screen overlying the region is blocked so that no resist is deposited where the bump is to be formed. The screen is open in the areas surrounding the blocked portion, permitting resist to be deposited over any non-planar surfaces surrounding the intended bump location. This provides a substantially planar surface which may be used as a mask for direct paste deposition into the region where the bump is to be formed, or the planar surface may be used as a flat surface upon which a stencil may be supported. After formation of the bump of conductive or non-conductive paste, the sacrificial resist layer is removed.