Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

Abstract: This disclosure relates to visible light communication (VLC) system-on-a-chip (SoC) systems/methods and VLC system-in-a-package (SiP) systems/methods. A VLC SoC system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate. A VLC SiP system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate and an LED fabricated in a compound semiconductor. The integrated circuit and the LED may be packaged in a SiP module. Interconnects may be formed between the integrated circuit and the LED.

Abstract: A system for generating clock signals for a photonic quantum computing system includes a pump photon source configured to generate a plurality of pump photon pulses at a first repetition rate, a waveguide optically coupled to the pump photon source, and a photon-pair source optically coupled to the first waveguide. The system also includes a photodetector optically coupled to the photon-pair source and configured to generate a plurality of electrical pulses in response to detection of at least a portion of the plurality of pump photon pulses at the first repetition rate and a clock generator coupled to the photodetector and configured to convert the plurality of electrical pulses into a plurality of clock signals at the first repetition rate.

Abstract: Process kit components for use with a substrate support of a process chamber are provided herein. In some embodiments, a process kit ring may include a ring shaped body having an outer edge, an inner edge, a top surface and a bottom, wherein the outer edge has a diameter of about 12.473 inches to about 12.479 inches and the inner edge has a diameter of about 11.726 inches to about 11.728 inches, and wherein the ring shaped body has a height of about 0.116 to about 0.118 inches; and a plurality of protrusions disposed on the top surface of the ring shaped body, each of the plurality of protrusions disposed symmetrically about the ring shaped body.

Abstract: This disclosure relates to visible light communication (VLC) system-on-a-chip (SoC) systems/methods and VLC system-in-a-package (SiP) systems/methods. A VLC SoC system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate. A VLC SiP system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate and an LED fabricated in a compound semiconductor. The integrated circuit and the LED may be packaged in a SiP module. Interconnects may be formed between the integrated circuit and the LED.

Abstract: A photoplethysmographic (PPG) device is disclosed. The PPG device can include one or more light emitters and one or more light sensors to generate the multiple light paths for measuring a PPG signal and perfusion indices of a user. The multiple light paths between each pair of light emitters and light detectors can include different separation distances to generate both an accurate PPG signal and a perfusion index value to accommodate a variety of users and usage conditions. In some examples, the multiple light paths can include the same separation distances for noise cancellation due to artifacts resulting from, for example, tilt and/or pull of the device, a user's hair, a user's skin pigmentation, and/or motion. The PPG device can further include one or more lenses and/or reflectors to increase the signal strength and/or and to obscure the optical components and associated wiring from being visible to a user's eye.

Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

Abstract: A photoplethysmographic (PPG) device is disclosed. The PPG device can include one or more light emitters and one or more light sensors to generate the multiple light paths for measuring a PPG signal and perfusion indices of a user. The multiple light paths between each pair of light emitters and light detectors can include different separation distances to generate both an accurate PPG signal and a perfusion index value to accommodate a variety of users and usage conditions. In some examples, the multiple light paths can include the same separation distances for noise cancellation due to artifacts resulting from, for example, tilt and/or pull of the device, a user's hair, a user's skin pigmentation, and/or motion. The PPG device can further include one or more lenses and/or reflectors to increase the signal strength and/or and to obscure the optical components and associated wiring from being visible to a user's eye.

Abstract: This disclosure relates to visible light communication (VLC) system-on-a-chip (SoC) systems/methods and VLC system-in-a-package (SiP) systems/methods. A VLC SoC system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate. A VLC SiP system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate and an LED fabricated in a compound semiconductor. The integrated circuit and the LED may be packaged in a SiP module. Interconnects may be formed between the integrated circuit and the LED.

Abstract: A heat-treated titanium nitride film including a polymeric substrate and at least one titanium nitride layer is disclosed. The titanium nitride layer of the film is characterized by microscopic uniform generally parallel surface cracking in the machine direction of the film. The film is particularly useful as a solar control film suitable for application to a contoured transparent substrate with reduced or eliminated ghosting. A method for treating a titanium nitride film prior to application to a transparent contoured substrate and a method for applying a titanium nitride film to a transparent contoured substrate are also described.

Abstract: Monolithic capacitor structures having a main capacitor and a vise capacitor are discussed. The vise capacitor provides to the monolithic capacitor structure reduced vibrations and/or acoustic noise due to piezoelectric effects. To that end, vise capacitor may cause piezoelectric deformations that compensate the deformations that are caused by the electrical signals in the main capacitor. Embodiments of these capacitor structures may have the main capacitor and the vise capacitor sharing portions of a rigid dielectric. Electrical circuitry that employs the vise capacitor to reduce noise and/or vibration in the monolithic capacitor structures is also described. Methods for fabrication of these capacitors are discussed as well.

Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a mechanical input configured to rotate in a first direction about a rotation axis in response to a first input at the mechanical input. In some examples, the electronic device comprises a mechanical input sensor coupled to the mechanical input and configured to sense a rotation of the mechanical input about the rotation axis. In some examples, the electronic device comprises a mechanical input actuator coupled to the mechanical input and configured to rotate the mechanical input in a second direction about the rotation axis. In some examples, the mechanical input comprises a shared driving and sensing segment. In some examples, the mechanical input sensor is configured to sense the rotation of the mechanical input at the shared driving and sensing segment. In some examples, the mechanical input actuator is configured to generate magnetic fields for rotating the mechanical input at the shared driving and sensing segment.

Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

Abstract: A multi-touch remote control method comprises following steps: a remote control device receiving a touch gesture input; computing a number of the touch points of the touch gesture input; generating and transferring a mouse event data to a receiving device as a mouse input if the number of the touch points is 1; and generating and transferring a single touch event data to the receiving device as a single touch input if the number of the touch points is greater than 1 and all the touch points of the touch gesture input are close to each other.

Abstract: A system, computer-readable storage medium, and computer-implemented method for creating a crowdsourced content publication. Layout information defining a layout of elements of a crowdsourced content publication is received. Contribution privilege information identifying a group of users of a social networking service as contributors to the crowdsourced content publication is received. The group of users may belong to a common organization as defined by a social graph maintained by the social networking service. Content criteria information specifying one or more criteria for selection of content included in the crowdsourced content publication is then received. The layout information, contribution privilege information, and content criteria information are then processed to generate a template for the crowdsourced content publication.

Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.