Patents by Inventor Albert Wong Chan

Albert Wong Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive composition
    Patent number: 6579474
    Abstract: A conductive composition, and articles and methods using the conductive composition are disclosed.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: June 17, 2003
    Assignee: Fujitsu Limited
    Inventors: Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert Wong Chan, Yasuhito Takahashi
  • Conductive composition
    Publication number: 20010030062
    Abstract: A conductive composition, and articles and methods using the conductive composition are disclosed.
    Type: Application
    Filed: February 12, 2001
    Publication date: October 18, 2001
    Inventors: Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert Wong Chan, Yasuhito Takahashi
  • Methods for making circuit substrates and electrical assemblies
    Patent number: 6281040
    Abstract: Methods for making circuit substrates and electrical assemblies are disclosed. A conductive composition is disposed between confronting conductive regions and can be cured to form a via structure. The conductive composition includes conductive particles and a carrier. The carrier can include a fluxing agent and an epoxy-functional resin having a viscosity of less than about 1000 centipoise at 25° C.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: August 28, 2001
    Assignee: Fujitsu Limited
    Inventors: Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert Wong Chan, Yasuhito Takahashi
  • Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
    Patent number: 6054761
    Abstract: Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt.
    Type: Grant
    Filed: December 1, 1998
    Date of Patent: April 25, 2000
    Assignee: Fujitsu Limited
    Inventors: Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert Wong Chan, Yasuhito Takahashi