Abstract: A method including: forming a stack of resistive layers; prior to or subsequent to forming the stack of resistive layers, forming a conductive layer; applying a mask layer on the stack of resistive layers or the conductive layer; forming a first spacer on the mask layer; and etching away a first portion of the mask layer using the first spacer as a first mask to provide a remainder. The method further includes: forming a second spacer on the stack of the resistive layers or the conductive layer and the remainder of the mask layer; etching away a second portion of the remainder of the mask layer to form an island; and using the island as a second mask, etching the stack of the resistive layers to form a resistive element of a memory, and etching the conductive layer to form a conductive element of the memory.

Abstract: Some of the embodiments of the present disclosure provide a semiconductor package interposer comprising a substrate having a first surface and a second surface, a plurality of vias extending between the first surface and the second surface of the substrate, the plurality of vias electrically connecting electrical connectors or circuitry on the first surface of the substrate to electrical connectors or circuitry on the second surface of the substrate, and metal plugs at least partially filling the plurality of vias. At least one of (i) the first surface or (ii) the second surface of the substrate includes depressions at distal ends of the metal plugs.

Abstract: Embodiments of the present disclosure provide a method that includes providing a semiconductor substrate comprising a semiconductor material, forming a dielectric layer on the semiconductor substrate, forming an interconnect layer on the dielectric layer, attaching a semiconductor die to the semiconductor substrate, and electrically coupling an active side of the semiconductor die to the interconnect layer, the interconnect layer to route electrical signals of the semiconductor die. Other embodiments may be described and/or claimed.

Abstract: Embodiments include a semiconductor device comprising: a substrate; a first transistor formed on the substrate; and a second transistor formed on the substrate, wherein a common region of the semiconductor device forms (i) a drain region of the first transistor, and (ii) a source region of the second transistor, and wherein a gate region of the first transistor is electrically coupled to a gate region of the second transistor.

Abstract: Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.

Abstract: Embodiments of the present disclosure provide a method comprising forming an electrically conductive structure on a surface of a semiconductor die, attaching the semiconductor die to a substrate, forming a molding compound to encapsulate the semiconductor die, forming an opening in the molding compound, the opening to at least partially expose the electrically conductive structure, and electrically coupling a passive component to the electrically conductive structure through the opening in the molding compound. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide configurations for a semiconductor package and associated methods of fabricating the semiconductor package. A method of fabricating a semiconductor package includes attaching a semiconductor die to a first substrate, attaching a second substrate to the first substrate, wherein the semiconductor die is embedded in between the first substrate and the second substrate, and forming an electrically insulative structure to substantially encapsulate the semiconductor die, wherein forming the electrically insulative structure is performed subsequent to the second substrate being attached to the first substrate. Additional embodiments may be described and/or claimed.

Abstract: Embodiments of the present invention provide an apparatus that includes a semiconductor substrate comprising a first surface having one or more integrated circuit devices formed thereon and a second surface opposite the first surface, wherein one or more vias are formed through the semiconductor substrate to couple the first surface with the second surface. The apparatus may further include a redistribution layer coupled with the second surface of the semiconductor substrate, wherein the one or more vias couple the redistribution layer with the first surface of the semiconductor substrate. Other embodiments including, for example, associated packages and methods may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide a chip that comprises a base metal layer formed over a first semiconductor die and a first metal layer formed over the base metal layer. The first metal layer includes a plurality of islands configured to route at least one of (i) a ground signal or (ii) a power signal in the chip. The chip further comprises a second metal layer formed over the first metal layer. The second metal layer includes a plurality of islands configured to route at least one of (i) the ground signal or (ii) the power signal in the chip.

Abstract: A system including first and second devices. The first device generates a trigger signal to test a memory. The memory has memory cells including first and second cells. The first and second cells are defective and are in a same row or column. The second device: tests the memory in response to the trigger signal and based on a first frequency; generates an error signal in response to detecting the first cell as defective; and based on the test, generates information including first and second addresses of the first and second cells. The first device, based on the error signal, receives the information at a second frequency. The second device compares the first and second addresses, and if a match, continues the test without reporting the second cell as defective. The first device, based on a number of times the first address is matched, repairs the row or the column.

Abstract: A system including a resistive random access memory cell connected to a word line and a bit line and a pre-charge circuit configured to pre-charge the bit line to a first voltage with the word line being unselected. A driver circuit selects the word line at a first time subsequent to the bit line being charged to the first voltage. A comparator compares a second voltage on the bit line to a third voltage supplied to the comparator and generates an output based on the comparison. A latch latches the output of the comparator and generates a latched output. A pulse generator generates a pulse after a delay subsequent to the first time to clock the latch to latch the output of the comparator and generate the latched output. The latched output indicates a state of the resistive random access memory cell.

Abstract: A system includes a resistive random access memory cell and a driver circuit. The resistive random access memory cell includes a resistive element and a switching element, and has a first terminal connected to a bit line and a second terminal connected to a word line. The driver circuit is configured to apply, in response to selection of the resistive random access memory cell using the word line, a first voltage of a first polarity to the bit line to program the resistive random access memory cell to a first state by causing current to flow through the resistive element in a first direction, and a second voltage of a second polarity to the bit line to program the resistive random access memory cell to a second state by causing current to flow through the resistive element in a second direction.

Abstract: Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.

Abstract: A cell of a resistive random access memory including (i) a resistive element and (ii) a switch. The resistive element includes (i) a first electrode, and (ii) a second electrode. The switch includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. The second contact is connected to the second electrode of the resistive element via a third contact. The third contact has a shape including a first surface and a second surface that is opposite to the first surface. The shape of the third contact tapers inward from the first surface towards the second surface.

Abstract: Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in the active area; forming source and drain contacts over the source and drain regions, where a spacing from the gate to the source contact of the transistor is less than a spacing from the gate to the drain contact of the transistor; and using one or more modified masks for forming doping profiles for the source region and the drain region.

Abstract: Embodiments of the present disclosure provide an apparatus that comprises a connection circuit situated within a substrate and configured to communicatively couple a first integrated circuit disposed adjacent to a top surface of the apparatus to a second integrated circuit disposed adjacent to a bottom surface of the apparatus. The apparatus further comprises one or more enclosed heat dissipation structures situated within the substrate and configured to convey heat away from the first and second integrated circuits.

Abstract: Embodiments of the present disclosure provide a method comprising forming an electrically conductive structure on a surface of a semiconductor die, attaching the semiconductor die to a substrate, forming a molding compound to encapsulate the semiconductor die, forming an opening in the molding compound, the opening to at least partially expose the electrically conductive structure, and electrically coupling a passive component to the electrically conductive structure through the opening in the molding compound. Other embodiments may be described and/or claimed.

Abstract: A memory including a memory cell and first and second modules. The memory cell has first and second states, where the second state is different than the first state. The first module, subsequent to an initial forming of the memory cell and subsequent to a read cycle or a write cycle of the memory cell, determines a first difference between the first state and a first predetermined threshold or a second difference between the first state and the second state. The second module, subsequent to the first module determining the first difference or the second difference, reforms the memory cell to reset and increase the first difference or the second difference. The second module, during the reforming of the memory cell, applies a first voltage to the memory cell. The first voltage is greater than a voltage applied to the memory cell during the read cycle or the write cycle.

Abstract: A resistive memory having a plurality of resistive elements, each having a resistance that changes with respect to a state of the resistive memory element. The resistive memory includes a substrate, a first memory access device formed on the substrate, a first contact formed on the first memory access device, and a first resistive memory element formed on the first contact. The first resistive memory element has a first polarity. The first memory access device provides read and write access to the state of the first resistive memory element. A second memory access device is formed on the substrate, a second contact formed on the second memory access device, and a second resistive memory element formed on the second contact. The second resistive memory element has a second polarity. The second memory access device provides read and write access to the state of the second resistive memory element.

Abstract: Embodiments of the present disclosure provide a chip that comprises a base metal layer formed over a first semiconductor die and a first metal layer formed over the base metal layer. The first metal layer includes a plurality of islands configured to route at least one of (i) a ground signal or (ii) a power signal in the chip. The chip further comprises a second metal layer formed over the first metal layer. The second metal layer includes a plurality of islands configured to route at least one of (i) the ground signal or (ii) the power signal in the chip.