Abstract: A portable two-mode probe intended to be applied against a biological tissue to be examined, the probe comprising: an ultrasonic transducer (34, 63), configured to emit ultrasonic waves into the tissue and to receive ultrasonic waves reflected by the tissue, the transducer extending along a transverse axis; at least two optodes (32, 60, 62a, 62b) placed on either side of the transverse axis, such that the transducer extends between the two optodes; each optode comprising a casing (52, 61), the casing containing: a light emitter (31), configured to emit a light wave toward the tissue; and/or an optical detector (32), configured to detect a light wave scattered by the tissue; the optodes being arranged such that at least one light emitter and at least one optical detector are placed on either side of the transducer; at least one optical detector having a detection area (53, 63a, 63b) formed from a semiconductor and connected to a circuit board (54).

Abstract: A method for operating a point laser-scanning microscope includes scanning a sample with a focused illumination laser beam; recording a plurality of images by detecting elements being configurable to an intensity mode, in which the recorded images are intensity images gi,j(n) related to photons collected during an entire dwell time of the illumination beam on an individual position n, or to a time-resolved mode, in which the recorded images are time-resolved images gi,jt(n, t), the collected photons being discriminated based on their arrival times to individual detecting elements; calculating a fingerprint image a by summing the plurality of intensity images gi,j(n) over all positions n; estimating shift matrices sx and sy from the intensity images gi,j(n); reconstructing at least one of a time-resolved object function ft and an intensity object function f; and visualizing at least one of a high-resolution time-resolved image ft˜ and a high-resolution intensity image f˜.

Abstract: A photodetector may include an array of microcells and an output module configured to collect, from each microcell, an output signal indicative of a photon detection and to combine the collected output signals in at least one output line. Each microcell comprises a first device and a second device, wherein at least one of the devices is a photosensitive device capable of detecting the photon; a time-gating module connected to said at least one photosensitive device and configured to provide a gate signal to the at least one photosensitive device to activate it; and a readout module configured to receive, upon arrival of the photon on the at least one activated photosensitive device, a corresponding signal from the at least one activated photosensitive device and, on the basis of the received signal, to provide the output signal to the output module.

Abstract: A method for operating a point laser-scanning microscope comprises scanning a sample with a focused illumination laser beam; recording a plurality of images by detecting elements being configurable to an intensity mode, in which the recorded images are intensity images gi,j(n) related to photons collected during an entire dwell time of the illumination laser beam on an individual position n, or to a time-resolved mode, in which the recorded images are time-resolved images gi,jt(n,t), the collected photons being discriminated based on their arrival times to individual detecting elements; calculating a fingerprint image a by summing the plurality of intensity images gi,j(n) over all positions n; estimating shift matrices sx and sy from the intensity images gi,j(n); reconstructing at least one of a time-resolved object function ft and an intensity object function f; and visualizing at least one of a high-resolution time-resolved image ft˜ and a high-resolution intensity image f˜.

Abstract: Systems and methods for detecting unauthorized removal or tampering. A system comprises an input device comprising a secure area and a circuit assembly coupled with the exterior of the input device. The circuit assembly comprises a plurality of flexible dielectric substrates. The circuit assembly further comprises at least one switch and at least one tamper-responsive conductor circuit, the at least one switch and the at least one tamper-responsive conductor circuit in electrical communication with the secure area of the input device. The at least one switch is in electrical communication with the secure area of the input device via a conductive path, and the at least one tamper-responsive conductor circuit covers the conductive path on at least one side thereof. The secure area of the input device is operative to detect whether the input device has been removed from a structure based on the position of the switch.

Abstract: A system for detecting unauthorized removal or tampering. The system comprises a printed circuit board having tamper-response electronics and a flexible circuit assembly defining a connector portion, a switch portion, and a cable extending between the connector portion and the switch portion. The flexible circuit assembly is coupled with the printed circuit board at the connector portion. The flexible circuit assembly comprises a plurality of layers each comprising a flexible dielectric substrate and a switch disposed in the switch portion. The switch is in electrical communication with the tamper-response electronics of the printed circuit board via a conductive path. The flexible circuit assembly also comprises a tamper-responsive conductor circuit enclosing the conductive path. The tamper-responsive conductor circuit is in electrical communication with the tamper-response electronics of the printed circuit board.

Abstract: A system for detecting unauthorized removal or tampering. The system comprises a printed circuit board having tamper-response electronics and a flexible circuit assembly defining a connector portion, a switch portion, and a cable extending between the connector portion and the switch portion. The flexible circuit assembly is coupled with the printed circuit board at the connector portion. The flexible circuit assembly comprises a plurality of layers each comprising a flexible dielectric substrate and a switch disposed in the switch portion. The switch is in electrical communication with the tamper-response electronics of the printed circuit board via a conductive path. The flexible circuit assembly also comprises a tamper-responsive conductor circuit enclosing the conductive path. The tamper-responsive conductor circuit is in electrical communication with the tamper-response electronics of the printed circuit board.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

Abstract: Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

Abstract: A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT.

Abstract: Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.

Abstract: Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Abstract: Systems and methods for making electrical measurements using optical emissions include positioning a sensor/photodetector to measure radiation emissions from devices to be tested. Radiation emission information is collected from the device to be tested during electrical operation. Characteristic features of the radiation emission information are determined, and differences between the characteristic features are deciphered. Based on the differences, models are employed to determine electrical properties of the device, especially operational characteristics.