Abstract: An integrated circuit fabrication process including exposing a photoresist layer and providing a hydrophilic layer above the photoresist layer. The photoresist layer is exposed to a pattern of electromagnetic energy. The polymers in the hydrophilic layer can diffuse into the photoresist layer after provision of the hydrophilic layer. The diffusion can lead to plasticization of the photoresist layer polymers in exposed regions relative to unexposed regions. The process can be utilized to form a large variety of integrated circuit structures including gate structures and other features with wide process latitude and smooth feature side walls.

Abstract: In one embodiment, a polarization measuring device comprises a light source, a reticle positioned below the light source, an opaque frame having a single aperture, the opaque frame positioned below the reticle, a lens positioned below the opaque frame, and a wafer having photoresist on its surface. The aperture of the frame allows no more than a first light ray to pass from the light source through the reticle and the lens onto a first surface point on the photoresist. The aperture of the frame also allows no more than a second light ray to pass from the light source through the reticle and the lens onto a second surface point on the photoresist. The degree of polarization of the light source can be determined from the first amount of light absorbed at the first surface point and the second amount of light absorbed at the second surface point.

Abstract: A process for improving the accuracy of critical dimension measurements of features patterned on a photoresist layer using a scanning electron microscope (SEM) is disclosed herein. The process includes providing an electron beam to the photoresist layer and transforming the surface of the photoresist layer before the SEM inspection. The surface of the photoresist layer is transformed to trap the outgassing volatile species and dissipates built up charge in the photoresist layer, resulting in SEM images without poor image contrast.

Abstract: A process for improving the accuracy of critical dimension measurements of features patterned on a photoresist layer using a scanning electron microscope (SEM) is disclosed herein. The process includes providing an electron beam to the photoresist layer and transforming the surface of the photoresist layer before the SEM inspection. The surface of the photoresist layer is transformed to trap the outgassing volatile species and dissipates built up charge in the photoresist layer, resulting in SEM images without poor image contrast.