Abstract: A substrate has a first surface and a second surface opposed to each other. A blind hole is formed in the substrate extending from the first surface at a location for each through via. Each blind hole is filled with a conductive filler; a deepest part of each filler forming a bump portion made of a solder material. Part of the substrate extending from the second surface is removed to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding solder bump.

Abstract: A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.

Abstract: A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.

Abstract: An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed.

Abstract: A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.

Abstract: An integrated electronic device includes at least one supply pin and at least one booster coupled to said at least one supply pin. Moreover, there is at least one integrated circuit powered by the at least one booster and associated therewith in a “system in a package configuration.

Abstract: An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first subsystem and the second subsystem are respectively integrated on a first material chip and on a second material chip, the plurality of electric connections including a plurality of conductive through holes formed in at least one of the first and second chips and adapted to form a corresponding plurality of inter-chip electric connections when the first and the second chips are superimposed.

Abstract: A low supply voltage memory device includes a first supply pin and a second supply pin for the connection to a first supply voltage source (VDD) and to a second supply voltage source (VDDQ). The device may include a memory and at least one booster overlapped by way of a “system in package” system and in particular with “stacked-die” technology. This booster may be connected to the memory by way of a plurality of discrete components.

Abstract: The memory device has a memory block, formed by a plurality of standard sectors and a redundancy portion; a control circuit, which controls programming and erasing of the data of the memory cells; and a correctness verifying circuit for the data stored in the memory cells. The correctness verifying circuit is enabled by the control circuit and generates an incorrect-datum signal in the event of detection of at least one non-functioning cell. The control circuit moreover activates redundancy, enabling the redundancy portion and storing redundancy data in a redundancy-memory stage in response to detecting an incorrect datum. Various solutions implement column, row and sector redundancy, both in case of erasing and programming.

Abstract: A self-repair method intervenes at the end of an operation of modification of a nonvolatile memory, selected between programming and erasing, in the event of detection of just one non-functioning cell, and carries out redundancy of the non-functioning cell. To this end, the memory array is divided into a basic portion, formed by a plurality of memory cells storing basic data, and into an in-the-field redundancy portion. The in-the-field redundancy portion is designed to store redundancy data that include a correct content of the non-functioning cell, the address of the non-functioning cell, and an activated redundancy flag. The redundancy is activated only after applying a preset maximum number of modification pulses and uses a redundancy replacement circuit and a redundancy data verification circuit.

Abstract: The method for using a nonvolatile memory (1) having a plurality of cells (14), each of which stores a datum, is based upon the steps of performing an modification operation of erasing/programming (22) the data of the memory; verifying (23) the correctness of the data of the memory cells; and, if the step of verifying (23) has revealed at least one incorrect datum, correcting on-th-field (46) the incorrect datum, using an error correcting code. The verification (23) of the correctness of the data is performed by determining (23) the number of memory cells storing an incorrect datum; if the number of memory cells storing the incorrect datum is less than or equal to a threshold (46), the erroneous datum is corrected by the error correction code; otherwise, new erasing/programming pulses are supplied.

Abstract: The memory device has a memory block, formed by a plurality of standard sectors and a redundancy portion; a control circuit, which controls programming and erasing of the data of the memory cells; and a correctness verifying circuit for the data stored in the memory cells. The correctness verifying circuit is enabled by the control circuit and generates an incorrect-datum signal in the event of detection of at least one non-functioning cell. The control circuit moreover activates redundancy, enabling the redundancy portion and storing redundancy data in a redundancy-memory stage in the presence of an incorrect datum. Various solutions are presented that implement column, row and sector redundancy, both in case of erasing and programming.

Abstract: The self-repair method for a nonvolatile memory intervenes at the end of an operation of modification, selected between programming and erasing, in the event of detection of just one non-functioning cell, and carries out redundancy of the non-functioning cell. To this end, the memory array is divided into a basic portion, formed by a plurality of memory cells storing basic data, and into a in-the-field redundancy portion, said in-the-field redundancy portion being designed to store redundancy data including a correct content of the non-functioning cell, the address of the non-functioning cell, and an activated redundancy flag. The redundancy is activated only after applying a preset maximum number of modification pulses and uses a purposely designed redundancy replacement circuit and a purposely designed redundancy data verification circuit.

Abstract: The method for using a nonvolatile memory having a plurality of cells, each of which stores a datum, is based upon the steps of performing an modification operation of erasing/programming the data of the memory; verifying the correctness of the data of the memory cells; and, if the step of verifying has revealed at least one incorrect datum, correcting on-the-field the incorrect datum, using an error correcting code. The verification of the correctness of the data is performed by determining the number of memory cells storing an incorrect datum; if the number of memory cells storing the incorrect datum is less than or equal to a threshold, the erroneous datum is corrected by the error correction code; otherwise, new erasing/programming pulses are supplied.

Abstract: A method for recovering the original properties of a silicon oxide film that has suffered a high energy implantation of dopants in the underlying silicon substrate, includes a brief heat treatment without causing an excessive lateral diffusion in the silicon substrate of the implanted dopants. Heat treating in an oven at a temperature of 800° C. for few minutes per wafer, which was subjected to high energy implantation, makes it possible to recover etch rate characteristics that are practically similar to those of the original non-implanted silicon oxide.

Abstract: A planarization process for the manufacturing of highly-planar interlayer dielectric thin films in integrated circuits, particularly in non-volatile semiconductor memory devices, comprises the steps of: forming a first barrier layer over a semiconductor substrate wherein integrated devices have been previously obtained; forming a second layer of oxide containing phosphorous and boron over the first undoped oxide the concentration of boron being lower than the concentration of phosphorous; forming a third layer of oxide containing phosphorous and boron over the second oxide layer, the concentration of phosphorous being lower than or equal to the concentration of boron; performing a thermal process at a temperature sufficient to melt the third oxide layer, to obtain a planar surface.

Abstract: A method for measuring the degree of planarity in an integrated circuit includes depositing, onto a dielectric layer to be measured for planarity, a predetermined measure path of a conductive film and measuring the electric resistance of said measure path. The resistance of such a measure path is minimal where the surface on which it has been deposited is perfectly planar, and increases with the surface deviation from perfect planarity. An integrated circuit containing a measurement portion of conductive film and a reference portion of conductive film is described.