Patents by Inventor Aldona Jagminiene
Aldona Jagminiene has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220064801Abstract: The invention relates to selective deposition of a nickel layer on a copper surface. The invention may be used in the production of electrically conductive areas for electronic circuits. Method for nickel deposition on the surface of copper comprises immersing an item, which surface is to be deposited with the nickel layer, into one or more baths, of which at least one contains a reducing agent and of which at least one is adapted for (electroless) plating of nickel. In order to extend the field of application and to obtain practically pure nickel coatings, said reducing agent comprises boronic or phosphoric compounds, comprising morpholine borane (C4H9BNO), or dimethylamine borane (C2H7BN), or sodium tetrahydroborate (NaBH4), or sodium hypophosphite (NaH2PO2) and said reducing agent directly or indirectly reduces insoluble copper (I) or copper (II) compounds on the copper surface. At least one of the mention baths comprises a ligand or mixture thereof.Type: ApplicationFiled: December 15, 2020Publication date: March 3, 2022Inventors: Aldona Jagminiene, Ina Stankeviciene, Karolis Ratautas, Eugenijus Norkus, Gediminas Raciukaitis
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Patent number: 10982328Abstract: The present invention relates to a production of electro-conductive traces on the surface of polymeric articles using laser excitation for the areas to be metallised, followed by activation of the laser-treated areas with a metal salt solution, the article is later rinsed in distilled water, and the activated areas are metallised in the chemical plating bath. The aims of the invention are to produce cost-effective conductive traces of the circuits for the application in 3D moulded interconnect devices, to increase the quality of the circuit traces improving the selective metallization process. An irradiation dose and scanning parameters for the surface excitation are chosen experimentally, provided that a negative static charge appears on the surface of the laser-irradiated areas. The chosen parameters ensure that any surface degradation of the polymer is avoided.Type: GrantFiled: September 6, 2017Date of Patent: April 20, 2021Assignee: VALSTYBINIS MOKSLINIU TYRIMU INSTITUTAS FIZINIU IR TECHNOLOGIJOS MOKSLU CENTRASInventors: Karolis Ratautas, Gediminas Raciukaitis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Publication number: 20190360104Abstract: The present invention relates to a production of electro-conductive traces on the surface of polymeric articles using laser excitation for the areas to be metallised, followed by activation of the laser-treated areas with a metal salt solution, the article is later rinsed in distilled water, and the activated areas are metallised in the chemical plating bath. The aims of the invention are to produce cost-effective conductive traces of the circuits for the application in 3D moulded interconnect devices, to increase the quality of the circuit traces improving the selective metallization process. An irradiation dose and scanning parameters for the surface excitation are chosen experimentally, provided that a negative static charge appears on the surface of the laser-irradiated areas. The chosen parameters ensure that any surface degradation of the polymer is avoided.Type: ApplicationFiled: September 6, 2017Publication date: November 28, 2019Inventors: Karolis RATAUTAS, Gediminas RACIUKAITIS, Aldona JAGMINIENE, Ina STANKEVICIENE, Eugenijus NORKUS
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Patent number: 9499913Abstract: A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.Type: GrantFiled: April 2, 2014Date of Patent: November 22, 2016Assignee: Lam Research CorporationInventors: Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Loreta Tamasauskaite-Tamasiunaite, Aniruddha Joi, Yezdi Dordi
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Patent number: 9469902Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.Type: GrantFiled: February 18, 2014Date of Patent: October 18, 2016Assignee: Lam Research CorporationInventors: Eugenijus Norkus, Aldona Jagminiene, Albina Zieliene, Ina Stankeviciene, Loreta Tamasauskaite-Tamasiunaite, Aniruddha Joi, Yezdi Dordi
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Patent number: 9428836Abstract: A solution for electroless deposition of cobalt is provided. A reducing agent of Ti3+ ions is provided to the solution. Co2+ ions are provided to the solution.Type: GrantFiled: April 29, 2014Date of Patent: August 30, 2016Assignee: Lam Research CorporationInventors: Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Aniruddha Joi, Loreta Tamasauskaite-Tamasiunaite, Yezdi Dordi, Zita Sukackiene
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ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
Publication number: 20150307994Abstract: A solution for electroless deposition of nickel is provided. A reducing agent of Ti3+ ion is provided to the solution. Ni2+ ions are provided to the solution.Type: ApplicationFiled: April 29, 2014Publication date: October 29, 2015Applicant: Lam Research CorporationInventors: Eugenijus NORKUS, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Aldona JAGMINIENE, Ina STANKEVICIENE, Yezdi DORDI -
Publication number: 20150307995Abstract: A solution for electroless deposition of palladium is provided. A reducing agent of Co2+ or Ti3+ ions is provided to the solution. Pd2+ ions are provided to the solution.Type: ApplicationFiled: April 29, 2014Publication date: October 29, 2015Applicant: Lam Research CorporationInventors: Eugenijus NORKUS, Aldona JAGMINIENE, Ina STANKEVICIENE, Aniruddha JOI, Yezdi DORDI
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ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
Publication number: 20150307993Abstract: A solution for electroless deposition of cobalt is provided. A reducing agent of Ti3+ ions is provided to the solution. Co2+ ions are provided to the solution.Type: ApplicationFiled: April 29, 2014Publication date: October 29, 2015Applicant: Lam Research CorporationInventors: Eugenijus NORKUS, Ina STANKEVICIENE, Aldona JAGMINIENE, Aniruddha JOI, Loreta TAMASAUSKAITE-TAMASIUNAITE, Yezdi DORDI, Zita SUKACKIENE -
Publication number: 20150284857Abstract: A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.Type: ApplicationFiled: April 2, 2014Publication date: October 8, 2015Applicant: Lam Research CorporationInventors: Eugenijus NORKUS, Ina STANKEVICIENE, Aldona JAGMINIENE, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Yezdi DORDI
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Publication number: 20150232995Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.Type: ApplicationFiled: February 18, 2014Publication date: August 20, 2015Applicant: Lam Research CorporationInventors: Eugenijus NORKUS, Aldona JAGMINIENE, Albina ZIELIENE, Ina STANKEVICIENE, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Yezdi DORDI
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Patent number: 7988774Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.Type: GrantFiled: August 10, 2010Date of Patent: August 2, 2011Assignee: Lam Research CorporationInventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Publication number: 20100304562Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.Type: ApplicationFiled: August 10, 2010Publication date: December 2, 2010Applicant: Lam Research CorporationInventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Patent number: 7794530Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.Type: GrantFiled: December 22, 2006Date of Patent: September 14, 2010Assignee: Lam Research CorporationInventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Publication number: 20080152822Abstract: Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.Type: ApplicationFiled: December 22, 2006Publication date: June 26, 2008Inventors: Algirdas Vaskelis, Aldona Jagminiene, Ina Stankeviciene, Eugenijus Norkus
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Patent number: 7306662Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.Type: GrantFiled: May 11, 2006Date of Patent: December 11, 2007Assignee: Lam Research CorporationInventors: Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
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Patent number: 7297190Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.Type: GrantFiled: June 28, 2006Date of Patent: November 20, 2007Assignee: Lam Research CorporationInventors: Yezdi Dordi, William Thie, Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
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Publication number: 20070261594Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.Type: ApplicationFiled: May 11, 2006Publication date: November 15, 2007Applicant: LAM RESEARCH CORPORATIONInventors: Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene