Patents by Inventor Aleksandar Aleks Aleksov

Aleksandar Aleks Aleksov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect alloy material and methods
    Patent number: 9731369
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov
  • Flexible electronic system with wire bonds
    Patent number: 9591758
    Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: March 7, 2017
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleks Aleksov, Mauro Kobrinsky, Johanna Swan, Rajendra C. Dias
  • FLEXIBLE ELECTRONIC SYSTEM WITH WIRE BONDS
    Publication number: 20150282321
    Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Inventors: Aleksandar Aleks Aleksov, Mauro Kobrinsky, Johanna Swan, Rajendra C. Dias
  • INTERCONNECT ALLOY MATERIAL AND METHODS
    Publication number: 20140263588
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov