Abstract: A method for constructing a solenoid inductor of an IC package with active/passive devices includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.

Abstract: A method of controlling a vibrational transducer, the method comprising: tracking a temperature metric of the vibrational transducer; and controlling a drive signal for the vibrational transducer, where the drive signal is limited to a value to protect the vibrational transducer from over excursion, and where said value is a function of the tracked temperature metric.

Abstract: A packaged semiconductor die may include a package terminal array comprising a plurality of terminals, wherein a spacing between the plurality of terminals of the ball grid array is less than 0.5 mm. First and second high-voltage circuits of the die may output a differential signal to a first and second terminal that may exceed 15 volts, in which the first high-voltage circuit and the second high-voltage circuit are positioned symmetrically around an axis and in which the first terminal and the second terminal are located at an edge of the package terminal array. A low-voltage circuit may be coupled to a third terminal and positioned between the first high-voltage circuit and the second high-voltage circuit, wherein the low-voltage circuit comprises circuitry organized in columns aligned along an axis and having a width defined by a fraction of the terminal spacing pitch.

Abstract: A method may include measuring an electrical parameter of an electromagnetic load having a moving mass during the absence of a driving signal actively driving the electromagnetic load, measuring a mechanical parameter of mechanical motion of a host device comprising the electromagnetic load, correlating a relationship between the mechanical parameter and the electrical parameter, and calibrating the electromagnetic load across a plurality of mechanical motion conditions based on the relationship.

Abstract: A packaged semiconductor die may include a package terminal array comprising a plurality of terminals, wherein a spacing between the plurality of terminals of the ball grid array is less than 0.5 mm. First and second high-voltage circuits of the die may output a differential signal to a first and second terminal that may exceed 15 volts, in which the first high-voltage circuit and the second high-voltage circuit are positioned symmetrically around an axis and in which the first terminal and the second terminal are located at an edge of the package terminal array. A low-voltage circuit may be coupled to a third terminal and positioned between the first high-voltage circuit and the second high-voltage circuit, wherein the low-voltage circuit comprises circuitry organized in columns aligned along an axis and having a width defined by a fraction of the terminal spacing pitch.

Abstract: A system for detecting displacement of a movable member of an electromagnetic transducer having a magnetic coil-driven linear actuator with a static member and a movable mass mechanically coupled to the static member and having a back electromotive force present across terminals of a coil of the electromagnetic transducer is provided. The system may include a resistive-inductive-capacitive sensor comprising the coil, a driver configured to drive the resistive-inductive-capacitive sensor with a driving signal, a measurement circuit communicatively coupled to the resistive-inductive-capacitive sensor and configured to measure one or more of phase information and amplitude information associated with the resistive-inductive-capacitive sensor and based on the one or more of phase information and amplitude information, determine a displacement of movable mass, wherein the displacement of the movable mass causes a change in an impedance of the resistive-inductive-capacitive sensor.

Abstract: An acoustic testing apparatus may include connections for multiple devices under test (DUTs) to support simultaneous testing of two or more miniature electroacoustic devices. The acoustic testing apparatus may allow the testing of multiple DUTs with a ratio of less than one reference microphone per DUT. Thus, the speed of testing DUTs may be increased without adding significant cost through additional reference microphones. For example, a single reference microphone may be used to test two or four DUTs coupled together through an acoustic test cavity.

Abstract: A method for minimizing undesired movement of a moving mass of an electromagnetic load may include detecting undesired movement of the moving mass based on real-time measurements of one or more parameters associated with the electromagnetic load and, responsive to detecting undesired movement of the moving mass, affecting a signal applied to the moving mass to reduce the undesired movement.

Abstract: A method may include measuring an electrical parameter of an electromagnetic load having a moving mass during the absence of a driving signal actively driving the electromagnetic load, measuring a mechanical parameter of mechanical motion of a host device comprising the electromagnetic load, correlating a relationship between the mechanical parameter and the electrical parameter, and calibrating the electromagnetic load across a plurality of mechanical motion conditions based on the relationship.

Abstract: An acoustic testing apparatus may include connections for multiple devices under test (DUTs) to support simultaneous testing of two or more miniature electroacoustic devices. The acoustic testing apparatus may allow the testing of multiple DUTs with a ratio of less than one reference microphone per DUT. Thus, the speed of testing DUTs may be increased without adding significant cost through additional reference microphones. For example, a single reference microphone may be used to test two or four DUTs coupled together through an acoustic test cavity.

Abstract: In accordance with embodiments of the present disclosure, a system may include a digital correcting network for correcting for an intrinsic highpass filter of a microelectromechanical systems (MEMS) microphone such that a combined phase and magnitude response of a cascade of the intrinsic highpass filter and the digital correcting network substantially approximates the response of a target highpass filter.

Abstract: In accordance with embodiments of the present disclosure, a system may include a digital correcting network for correcting for an intrinsic highpass filter of a microelectromechanical systems (MEMS) microphone such that a combined phase and magnitude response of a cascade of the intrinsic highpass filter and the digital correcting network substantially approximates the response of a target highpass filter.

Abstract: A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.

Abstract: A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.

Abstract: An in-line microphone filter may include a housing and a filter circuit housed in the housing. A first connector at one end of the housing is connected to an input of the filter circuit and a second connector at another end of the housing is connected to an output of the filter circuit. The filter circuit may filter the microphone audio signal by changing sonic characteristics of the audio signal in a predetermined manner dependent upon a specific type of acoustic source or instrument.