Abstract: Provided herein is a method for decolorizing textile materials under hydrothermal conditions using dye adsorbent materials. The process is non-toxic and environmentally friendly, and the adsorbent materials can be repeatedly used. The textile materials are textile materials dyeable with disperse dyes. Further provided is a system for decolorizing textile materials. The decolorization system is designed to allow the adsorbent materials to react with the textile materials in a contact manner and a non-contact manner.

Abstract: A method for separating and recycling a waste polyester-cotton textile by a hydrothermal reaction catalyzed by an organic acid, comprising the following steps: dividing a waste polyester-cotton textile into fragments and dispersing in an aqueous solution system of the organic acid catalyst to obtain a mixed system; in a high-pressure reactor, heating the mixed system to 110˜180° C. so that cotton fibers in the waste polyester-cotton textile undergo a degradation reaction for 0.5˜3 h to obtain a mixture; and filtering the mixture by a sieve, washing to obtain a polyester fiber aggregate, and then filtering the remaining portion by a filtration membrane in vacuum so as to obtain cotton fiber fragments after washing. Embodiments of the present disclosure may provide advantages for the separation, recycling and reuse of waste polyester-cotton textiles. For example, the catalyst used during processing is derived from nature and is biodegradable.

Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.

Abstract: A printed circuit board (PCB) carrier including a multi-layer structure including a plurality of conductive layers and a plurality of insulating layers respectively spaced between the plurality of conductive layers, the multi-layer structure having a footprint corresponding to a large size component of the PCB, and a pocket formed in the multi-layer structure, the pocket configured to receive a discrete component of a size smaller than the large size component.

Abstract: A printed circuit board (PCB) carrier including a multi-layer structure including a plurality of conductive layers and a plurality of insulating layers respectively spaced between the plurality of conductive layers, the multi-layer structure having a footprint corresponding to a large size component of the PCB, and a pocket formed in the multi-layer structure, the pocket configured to receive a discrete component of a size smaller than the large size component.

Abstract: Attaching electronic components to a substrate can be challenging in certain applications. By utilizing printed conductive ink to fill vias, one or more conductive layers may be provided, which allow for fine pin pitches or other crowded substrates to utilize multiple layers for traces connecting the contact pad to the pins of an electronic component. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, and with conductive ink filling the vias, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.

Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.