Abstract: Integrity management architecture is extended with trusted hash provisioning. The trusted hash provisioning ensures the integrity of a computing device. Thus, a multipurpose device can be as secure as a dedicated single-purpose device. The trusted hash provisioning includes determining a hash mask, and computing a trusted hash computation based on signatures of components identified as included within the scope of the hash. The computed trusted hash computation is used to determine integrity of the computing device.

Abstract: In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.

Abstract: A method of manufacturing devices with device layers on both sides of a substrate according to an embodiment of the invention includes ensuring that the movements of the substrate during the exposure of the backside are a mirror image of the movements during the exposure of the frontside. In an application of such a method, positioning errors that are characteristic of direction of movement are thus reversed in the backside exposure as compared to the frontside exposure, such that the net overlay error between front and backside is zero or near zero. Embodiments of the invention may be used to reduce overlay errors arising out of certain types of positioning error at no cost, either in machine modifications or throughput.

Abstract: A lithographic production process according to one embodiment comprises an input section, pre-imaging processes, measurement of a substrate, exposure of the substrate, post-imaging processes, and output. A controller controls the time spent processing in the scanner based on an input of the rate at which substrates arrive from the pre-imaging processes. This control allows the scanner to optimize the accuracy of devices produced by selectively varying the duration of processes in the scanner.

Abstract: A lithographic production process according to one embodiment comprises an input section, pre-imaging processes, measurement of a substrate, exposure of the substrate, post-imaging processes, and output. A controller controls the time spent processing in the scanner based on an input of the rate at which substrates arrive from the pre-imaging processes. This control allows the scanner to optimize the accuracy of devices produced by selectively varying the duration of processes in the scanner.

Abstract: In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.