Abstract: A textile includes: (1) a matrix; and (2) particulate fillers dispersed within the matrix. The textile has a transmittance of infrared radiation at a wavelength of 9.5 ?m of at least about 40%, and the textile has a weighted average reflectivity of radiation over a wavelength range of 0.3 ?m to 2 ?m of at least about 40%.

Abstract: A spout and fitment assembly for a flexible bag. The spout comprises a base flange, a cylindrical upstand and a fitment coupling. The base flange is configured to be coupled to a flexible bag. The cylindrical upstand extends from the base flange. The cylindrical upstand defines a passageway therealong which is placeable in fluid communication with the flexible bag. The fitment coupling extends from the cylindrical upstand between the proximal end and the distal end thereof. The fitment assembly comprises a fitment body and a hose. The hose is coupled to the hose connection portion. The connector portion is sealingly engaged with the fitment coupling so as to place the inner bore in fluid communication with the passageway of the cylindrical upstand.

Abstract: A spout and fitment assembly for a flexible bag. The spout comprises a base flange, a cylindrical upstand and a fitment coupling. The base flange is configured to be coupled to a flexible bag. The cylindrical upstand extends from the base flange. The cylindrical upstand defines a passageway therealong which is placeable in fluid communication with the flexible bag. The fitment coupling extends from the cylindrical upstand between the proximal end and the distal end thereof. The fitment assembly comprises a fitment body and a hose. The hose is coupled to the hose connection portion. The connector portion is sealingly engaged with the fitment coupling so as to place the inner bore in fluid communication with the passageway of the cylindrical upstand.

Abstract: A leadless semiconductor package mainly comprises a semiconductor chip disposed on a die pad and electrically connected to a plurality of leads arranged around the die pad. There are a plurality of tie bars connected to the die pad. The lower surface of each lead has an indentation formed corresponding to one of the bottom edges of the package. The semiconductor chip, the leads and the tie bars are encapsulated in a package body wherein the lower surface of each lead is exposed from the bottom surface of the package except the indentation thereof.